Research Progress of Interfacial Modification of Copper/Diamond Composites for Electronic Packaging - Hu, Zhihua; Zhang, Bowen; Yu, Hongmei; Lei, Yan; Xiong, Haiyan; Jiang, Binghua; Chen, Deping (International journal of thermophysics, 2025)
Keywords: Chemical bonds; Chemical reactions; Classical Mechanics; Composite materials; Condensed Matter Physics; Contact angle; Copper; Diffusion; Electronic packaging; Heat transfer; Industrial Chemistry/Chemical Engineering; Metallizing; Physical Chemistry; Physics; Physics and Astronomy; Thermal conductivity; Thermal expansion; Transport properties; Wettability; Zirconium; Electronic packaging materials; Thermal conductivity; Diamond; Copper-matrix composites; Interfacial modification