Research Progress of Interfacial Modification of Copper/Diamond Composites for Electronic Packaging

Copper/diamond composites exhibit significant potential in various fields, including microelectronics, weaponry, power batteries and aerospace, owing to their adjustable transport properties, high thermal conductivity (TC), and customizable coefficients of thermal expansion. However, interface gaps...

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Published inInternational journal of thermophysics Vol. 46; no. 9
Main Authors Hu, Zhihua, Zhang, Bowen, Yu, Hongmei, Lei, Yan, Xiong, Haiyan, Jiang, Binghua, Chen, Deping
Format Journal Article
LanguageEnglish
Published New York Springer US 01.09.2025
Springer Nature B.V
Subjects
Chemical bonds
Chemical reactions
Classical Mechanics
Composite materials
Condensed Matter Physics
Contact angle
Copper
Diffusion
Electronic packaging
Heat transfer
Industrial Chemistry/Chemical Engineering
Metallizing
Physical Chemistry
Physics
Physics and Astronomy
Thermal conductivity
Thermal expansion
Transport properties
Wettability
Zirconium
Electronic packaging materials
Thermal conductivity
Diamond
Copper-matrix composites
Interfacial modification
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Abstract Copper/diamond composites exhibit significant potential in various fields, including microelectronics, weaponry, power batteries and aerospace, owing to their adjustable transport properties, high thermal conductivity (TC), and customizable coefficients of thermal expansion. However, interface gaps and weak bonding have significantly impeded the application of copper/diamond composites with high thermal conductivity. This paper summarizes the preparation methods and research advancements in the interfacial modification of copper/diamond composites. Revealing that the introduction of carbide-forming elements (e.g., Zr, Cr, Ti) via matrix alloying or diamond surface metallization significantly improves solid–liquid wettability (reducing contact angles below 90°) and enhances interfacial bonding through chemical reaction or atomic diffusion. These insights are crucial for enhancing the interfacial bonding between copper and diamond, thereby improving the thermal conductivity of the composites.
AbstractList Copper/diamond composites exhibit significant potential in various fields, including microelectronics, weaponry, power batteries and aerospace, owing to their adjustable transport properties, high thermal conductivity (TC), and customizable coefficients of thermal expansion. However, interface gaps and weak bonding have significantly impeded the application of copper/diamond composites with high thermal conductivity. This paper summarizes the preparation methods and research advancements in the interfacial modification of copper/diamond composites. Revealing that the introduction of carbide-forming elements (e.g., Zr, Cr, Ti) via matrix alloying or diamond surface metallization significantly improves solid–liquid wettability (reducing contact angles below 90°) and enhances interfacial bonding through chemical reaction or atomic diffusion. These insights are crucial for enhancing the interfacial bonding between copper and diamond, thereby improving the thermal conductivity of the composites.
ArticleNumber 130
Author Hu, Zhihua
Yu, Hongmei
Lei, Yan
Chen, Deping
Zhang, Bowen
Xiong, Haiyan
Jiang, Binghua
Author_xml – sequence: 1
  givenname: Zhihua
  surname: Hu
  fullname: Hu, Zhihua
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
– sequence: 2
  givenname: Bowen
  surname: Zhang
  fullname: Zhang, Bowen
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
– sequence: 3
  givenname: Hongmei
  surname: Yu
  fullname: Yu, Hongmei
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
– sequence: 4
  givenname: Yan
  surname: Lei
  fullname: Lei, Yan
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
– sequence: 5
  givenname: Haiyan
  surname: Xiong
  fullname: Xiong, Haiyan
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
– sequence: 6
  givenname: Binghua
  surname: Jiang
  fullname: Jiang, Binghua
  email: yeahjiang@163.com
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
– sequence: 7
  givenname: Deping
  surname: Chen
  fullname: Chen, Deping
  email: chendeping1030@qq.com
  organization: School of Materials and Environmental Engineering, Chengdu Technological University
BookMark eNp9kE1LAzEQhoNUsK3-AU8Lntfmo5s0R6lVCxWLKHgL2XysqW2yJluo_97UFbx5GIZh3vcd5hmBgQ_eAHCJ4DWCkE0SgoxWJcS5CIWwPJyAIaoYLnlF2QAMIeJVyfHs7QyMUtpACDnjZAjUs0lGRvVerGNookmpCLZY-s5EK5WT2-IxaGedkp0L_ribh7Y1cXLr5C54ncddG5LrTCpsiMVia1QXg3eqWEv1IRvnm3NwauU2mYvfPgavd4uX-UO5erpfzm9WpcIMdyUmTFmuZU00tpTAeiaZYhaxSipClbK1pVOtaP6UaV5xozRGzOi6lhRzTskYXPW5bQyfe5M6sQn76PNJQTBmBJIpm2YV7lUqhpSisaKNbifjl0BQHGGKHqbIMMUPTHHIJtKbUhb7xsS_6H9c36APe6M
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ContentType Journal Article
Copyright The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2025 Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
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DBID AAYXX
CITATION
DOI 10.1007/s10765-025-03600-x
DatabaseName CrossRef
DatabaseTitle CrossRef
DatabaseTitleList

DeliveryMethod fulltext_linktorsrc
Discipline Engineering
Physics
EISSN 1572-9567
ExternalDocumentID 10_1007_s10765_025_03600_x
GrantInformation_xml – fundername: the Sichuan Undergraduate Innovation and Entrepreneurship Training Programs
  grantid: S202411116003
– fundername: the research project of Chengdu Technological University
  grantid: 2023ZR002
– fundername: The Ministry of Education Chunhui Program
  grantid: Z2017064
– fundername: The Sichuan Provincial Nitrogen and Carbon High Molecular Weight New Materials Engineering Technology Research Centre Open Fund Project
  grantid: CNP-C-240208
GroupedDBID -~C
.86
.VR
06D
0R~
0VY
1N0
203
29J
29~
2J2
2JN
2JY
2KG
2KM
2LR
2~H
30V
4.4
406
408
409
40D
40E
5GY
5VS
67Z
6NX
8TC
8UJ
95-
95.
95~
96X
AABHQ
AACDK
AAHNG
AAIAL
AAJBT
AAJKR
AANZL
AAPKM
AARTL
AASML
AATNV
AATVU
AAUYE
AAWCG
AAYIU
AAYQN
AAYZH
ABAKF
ABBBX
ABBRH
ABBXA
ABDBE
ABDZT
ABECU
ABFSG
ABFTV
ABHLI
ABHQN
ABJNI
ABJOX
ABKCH
ABKTR
ABMNI
ABMQK
ABNWP
ABQBU
ABRTQ
ABSXP
ABTEG
ABTHY
ABTKH
ABTMW
ABWNU
ABXPI
ACAOD
ACDTI
ACGFS
ACHSB
ACHXU
ACKNC
ACMDZ
ACMLO
ACOKC
ACOMO
ACPIV
ACSNA
ACSTC
ACZOJ
ADHHG
ADHIR
ADIMF
ADKNI
ADKPE
ADRFC
ADTPH
ADURQ
ADYFF
ADZKW
AEFQL
AEGAL
AEGNC
AEJHL
AEJRE
AEMSY
AENEX
AEOHA
AEPYU
AESKC
AETLH
AEVLU
AEXYK
AEZWR
AFBBN
AFDZB
AFHIU
AFLOW
AFOHR
AFQWF
AFWTZ
AFZKB
AGAYW
AGDGC
AGMZJ
AGQEE
AGQMX
AGRTI
AGWIL
AGWZB
AGYKE
AHAVH
AHBYD
AHKAY
AHPBZ
AHSBF
AHWEU
AHYZX
AIAKS
AIGIU
AIIXL
AILAN
AITGF
AIXLP
AJRNO
AJZVZ
ALMA_UNASSIGNED_HOLDINGS
ALWAN
AMKLP
AMXSW
AMYLF
AMYQR
AOCGG
ARMRJ
ASPBG
ATHPR
AVWKF
AXYYD
AYFIA
AYJHY
AZFZN
B-.
BA0
BGNMA
BSONS
CS3
CSCUP
DDRTE
DL5
DNIVK
DPUIP
EBLON
EBS
EIOEI
ESBYG
F5P
FEDTE
FERAY
FFXSO
FIGPU
FNLPD
FRRFC
FWDCC
GGCAI
GGRSB
GJIRD
GNWQR
GQ7
GQ8
GXS
HF~
HG5
HG6
HMJXF
HQYDN
HRMNR
HVGLF
I09
IJ-
IKXTQ
ITM
IWAJR
IXC
IXE
IZIGR
IZQ
I~X
I~Z
J-C
J0Z
JBSCW
JCJTX
JZLTJ
KDC
KOV
LAK
LLZTM
M4Y
MA-
N9A
NB0
NPVJJ
NQJWS
NU0
O93
O9G
O9I
O9J
OAM
P19
P2P
P9T
PF0
PT4
PT5
QOK
QOS
R89
R9I
RHV
RNS
ROL
RPX
RSV
S16
S1Z
S27
S3B
SAP
SDH
SDM
SHX
SISQX
SJYHP
SNE
SNPRN
SNX
SOHCF
SOJ
SPH
SPISZ
SRMVM
SSLCW
STPWE
SZN
T13
TSG
TSK
TSV
TUC
U2A
UG4
UOJIU
UTJUX
VC2
W23
W48
WJK
WK8
YLTOR
Z45
ZMTXR
ZY4
~EX
-Y2
1SB
2.D
28-
2P1
2VQ
5QI
AARHV
AAYTO
AAYXX
ABQSL
ABULA
ACBXY
ADHKG
AEBTG
AEFIE
AEKMD
AFEXP
AFFNX
AFGCZ
AGGDS
AGJBK
AGQPQ
AJBLW
BBWZM
BDATZ
CAG
CITATION
COF
EJD
FINBP
FSGXE
GPTSA
H13
HZ~
IHE
KOW
N2Q
NDZJH
O9-
OVD
R4E
RNI
RZC
RZE
RZK
S26
S28
SCLPG
SGB
T16
TEORI
UZXMN
VFIZW
W4F
ID FETCH-LOGICAL-c272t-237cf9dab3d2f630b8a7c7f175ac36ccfbf64dc60767d959ecd217edbba629963
IEDL.DBID U2A
ISSN 0195-928X
IngestDate Sat Jul 26 16:12:05 EDT 2025
Thu Jul 31 00:43:00 EDT 2025
Sat Jul 26 01:16:03 EDT 2025
IsPeerReviewed true
IsScholarly true
Issue 9
Keywords Electronic packaging materials
Thermal conductivity
Diamond
Copper-matrix composites
Interfacial modification
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c272t-237cf9dab3d2f630b8a7c7f175ac36ccfbf64dc60767d959ecd217edbba629963
Notes ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 14
PQID 3227303474
PQPubID 2043777
ParticipantIDs proquest_journals_3227303474
crossref_primary_10_1007_s10765_025_03600_x
springer_journals_10_1007_s10765_025_03600_x
PublicationCentury 2000
PublicationDate 2025-09-01
PublicationDateYYYYMMDD 2025-09-01
PublicationDate_xml – month: 09
  year: 2025
  text: 2025-09-01
  day: 01
PublicationDecade 2020
PublicationPlace New York
PublicationPlace_xml – name: New York
PublicationSubtitle Journal of Thermophysical Properties and Thermophysics and Its Applications
PublicationTitle International journal of thermophysics
PublicationTitleAbbrev Int J Thermophys
PublicationYear 2025
Publisher Springer US
Springer Nature B.V
Publisher_xml – name: Springer US
– name: Springer Nature B.V
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SSID ssj0009793
Score 2.4073973
SecondaryResourceType review_article
Snippet Copper/diamond composites exhibit significant potential in various fields, including microelectronics, weaponry, power batteries and aerospace, owing to their...
SourceID proquest
crossref
springer
SourceType Aggregation Database
Index Database
Publisher
SubjectTerms Chemical bonds
Chemical reactions
Classical Mechanics
Composite materials
Condensed Matter Physics
Contact angle
Copper
Diffusion
Electronic packaging
Heat transfer
Industrial Chemistry/Chemical Engineering
Metallizing
Physical Chemistry
Physics
Physics and Astronomy
Thermal conductivity
Thermal expansion
Transport properties
Wettability
Zirconium
Title Research Progress of Interfacial Modification of Copper/Diamond Composites for Electronic Packaging
URI https://link.springer.com/article/10.1007/s10765-025-03600-x
https://www.proquest.com/docview/3227303474
Volume 46
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV1LSwMxEA7SIuhBtCpWa8nBmy7WPLvHtrYWpaUHC_W0ZPMAEbqlreDPd5LuulX04GHZQ0IO3yTzSL6ZQeiKUScgLHFRamIWMa5EpDhhUUqtNmAxubI-UXg0FsMpe5zxWZ4UtirY7sWTZNDUW8luUvhsYvgomOkIPMcq97E77OIp6ZSlduWm1G7oQkjaszxV5vc1vpuj0sf88SwarM3gEB3kbiLubOR6hHbsvIb2t4oH1tBuIG_q1THSBX0OTzzbCnQXzhwOd31O-StxPMqMpwQFKfixXrZY2OXt_avvNWSwVwqevGVXGHxY3P9qjYMnSr-FPkYnaDroP_eGUd48IdJEknVEqNQuNiqlhjhBW2lbSS2dR19TobVLQUhGCwBEmpjHIBqITqxJUyXARAl6iirzbG7PEAYPkVkCh9XwFtN3bWWIcU7F2mpnHOV1dF1gmCw2NTKSshqyRzwBxJOAePJRR40C5iQ_L6sE1AqoGsokq6ObAvpy-O_Vzv83_QLtkSB9TxJroMp6-W4vwatYp01U7Qy63bH_P7w89ZthU30C_NbJOA
linkProvider Springer Nature
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV3PT8IwFG4MxqgHo6gRRe3Bmy5i27XbkSAEFQgHSLgtXX8kxoQRhol_vq9lc2j04GGnLj18r33va_u99xC6YdRyOJbYINUxC1goeSBDwoKUGqUhYobSuETh4Yj3p-x5Fs6KpLC8VLuXT5LeU28kuwnusonhoxCmA2CO20AGIifkmpJ2VWpXrEvt-i6EJJoVqTK_z_E9HFUc88ezqI82vUN0UNBE3F7b9QhtmXkd7W8UD6yjHS_eVPkxUqV8Do-d2gp8F84s9nd9VrorcTzMtJMEeSu4sU62WJjl_eOr6zWksXMKTrxlcgwcFne_WuPgsVRvvo_RCZr2upNOPyiaJwSKCLIKCBXKxlqmVBPLaSuNpFDCOvQV5UrZFIykFQdAhI7DGEwDpxOj01RyCFGcnqLaPJubM4SBITJDYLPqsMXUQyQ10dbKWBlltaVhA92WGCaLdY2MpKqG7BBPAPHEI558NFCzhDkp9kuegFsBV0OZYA10V0JfDf892_n_fr9Gu_3JcJAMnkYvF2iP-JXgBGNNVFst380lMIxVeuUX1CcAzskb
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwlV07T8MwELYQCAQDggKiUMADG0RtbcdpxqoPlUerDlTqFjl-SAgpidog8fM5OwkpCAaGTI48fGffne3vu0PollHD4VhivFiFzGO-4J7wCfNiqqWCiOkLbYXC0xmfLNjj0l9uqPgd2716kiw0DbZKU5K3M2XaG8K3gFtlMXwUQrYHWeQOuOOuXdcL0q_L7gZF2V3XkZD0lqVs5vc5voemOt_88UTqIs_4CB2WKSPuFzY-Rls6aaCDjUKCDbTriJxyfYJkRaXDc8u8Aj-GU4PdvZ8R9nocT1Nl6UHOInZskGaZXrWHr7bvkMLWQVgil15jyGfx6KtNDp4L-eZ6Gp2ixXj0Mph4ZSMFT5KA5B6hgTShEjFVxHDaiXsikIGxlpCUS2liMJiSHAAJVOiHYCY4qWgVx4JDuOL0DG0naaLPEYZskWkCG1f5HSa7PaGIMkaEUkujDPWb6K7CMMqKehlRXRnZIh4B4pFDPPpoolYFc1TunXUELgbcDmUBa6L7Cvp6-O_ZLv73-w3amw_H0fPD7OkS7RO3ECx3rIW289W7voJkI4-v3Xr6BLp2zVc
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Research+Progress+of+Interfacial+Modification+of+Copper%2FDiamond+Composites+for+Electronic+Packaging&rft.jtitle=International+journal+of+thermophysics&rft.au=Hu%2C+Zhihua&rft.au=Zhang%2C+Bowen&rft.au=Yu%2C+Hongmei&rft.au=Lei%2C+Yan&rft.date=2025-09-01&rft.pub=Springer+US&rft.issn=0195-928X&rft.eissn=1572-9567&rft.volume=46&rft.issue=9&rft_id=info:doi/10.1007%2Fs10765-025-03600-x&rft.externalDocID=10_1007_s10765_025_03600_x
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0195-928X&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0195-928X&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0195-928X&client=summon