Thermal Behavior Analysis of Melamine Modified Urea-Formaldehyde Resin with Different Molar Ratios
In this study, Thermogravimetry (TG) were used to analyze thermal degradation properties of two kinds of low-molar ratio of the melamine-modified urea-formaldehyde resin (MUF). The MUF was calculated using Kissinger equation and Flynn-Wall-Ozawa equation Resin pyrolysis activation energy. The result...
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Published in | Materials science forum Vol. 1001; pp. 61 - 66 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
Pfaffikon
Trans Tech Publications Ltd
01.07.2020
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Subjects | |
Online Access | Get full text |
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Summary: | In this study, Thermogravimetry (TG) were used to analyze thermal degradation properties of two kinds of low-molar ratio of the melamine-modified urea-formaldehyde resin (MUF). The MUF was calculated using Kissinger equation and Flynn-Wall-Ozawa equation Resin pyrolysis activation energy. The results showed that the curing time of low mole was longer than that of MUF resin (muf-b), the content of free formaldehyde was lower, and the formaldehyde emission and wet bonding strength of plywood were reduced by 65.79% and 21.90%, respectively. TG test showed that the pyrolysis process of MUF resins with different molar ratios can be divided into three stages: dehydration, rapid pyrolysis and carbonization. At the same heating rate, the weight loss rate, peak conversion rate and carbon residue of the high molar ratio MUF resin (MUF-a) in the fast pyrolysis stage are larger than those of the MUF-b resin. The MUF-a resin pyrolysis activation energy is 166.76 kJ/mol, and the MUF-b resin pyrolysis activation energy is 95.30 kJ/mol. High molar ratio resin has higher pyrolysis activation energy and better thermal stability. |
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Bibliography: | Selected, peer-reviewed papers from the 2nd International Conference on Materials Science and Industrial Applications (MSIA 2020), January 11-12, 2020, Xi’an, China |
ISSN: | 0255-5476 1662-9752 1662-9752 |
DOI: | 10.4028/www.scientific.net/MSF.1001.61 |