Analysis of multi-field coupling behaviors of sandwich piezoelectric semiconductor beams under thermal loadings

• Published in: Applied mathematics and mechanics Vol. 46; no. 8; pp. 1571 - 1590
• Main Authors: Kong, Dejuan, He, Zhuangzhuang, Liu, Chengbin, Zhang, Chunli
• Format: Journal Article
• Language: English
• Published: Berlin/Heidelberg Springer Berlin Heidelberg 01.08.2025; Springer Nature B.V
• Edition: English ed.
• Subjects: Applications of Mathematics; Bending; Boundary conditions; Classical Mechanics; Coupling; Deformation; Exact solutions; Fluid- and Aerodynamics; Mathematical Modeling and Industrial Mathematics; Mathematical models; Mathematics; Mathematics and Statistics; Partial Differential Equations; Piezoelectricity; Pyroelectricity; Semiconductor devices; Thermal buckling; Thickness ratio; 74F15; TQ174; O343; sandwich beam; analytical solution; piezoelectric semiconductor (PS); critical buckling thermal loading; 35Q74; multi-field coupling behavior

Sandwich piezoelectric semiconductor (PS) structures have significant applications in multi-functional semiconductor devices. The analysis of multi-field coupling behaviors of PS structures is of fundamental importance in developing novel PS devices. In this paper, we develop a general temperature-d...