Analysis of multi-field coupling behaviors of sandwich piezoelectric semiconductor beams under thermal loadings - Kong, Dejuan; He, Zhuangzhuang; Liu, Chengbin; Zhang, Chunli (Applied mathematics and mechanics, 2025)
Keywords: Applications of Mathematics; Bending; Boundary conditions; Classical Mechanics; Coupling; Deformation; Exact solutions; Fluid- and Aerodynamics; Mathematical Modeling and Industrial Mathematics; Mathematical models; Mathematics; Mathematics and Statistics; Partial Differential Equations; Piezoelectricity; Pyroelectricity; Semiconductor devices; Thermal buckling; Thickness ratio; 74F15; TQ174; O343; sandwich beam; analytical solution; piezoelectric semiconductor (PS); critical buckling thermal loading; 35Q74; multi-field coupling behavior