APA (7th ed.) Citation

Kong, D., He, Z., Liu, C., & Zhang, C. (2025). Analysis of multi-field coupling behaviors of sandwich piezoelectric semiconductor beams under thermal loadings Applied mathematics and mechanics, 46(8), 1571-1590. https://doi.org/10.1007/s10483-025-3284-7

Chicago Style (17th ed.) Citation

Kong, Dejuan, Zhuangzhuang He, Chengbin Liu, and Chunli Zhang. "Analysis of Multi-field Coupling Behaviors of Sandwich Piezoelectric Semiconductor Beams Under Thermal Loadings." Applied Mathematics and Mechanics 46, no. 8 (2025): 1571-1590. https://doi.org/10.1007/s10483-025-3284-7.

MLA (9th ed.) Citation

Kong, Dejuan, et al. "Analysis of Multi-field Coupling Behaviors of Sandwich Piezoelectric Semiconductor Beams Under Thermal Loadings." Applied Mathematics and Mechanics, vol. 46, no. 8, 2025, pp. 1571-1590, https://doi.org/10.1007/s10483-025-3284-7.