A hybrid vapor chamber heat sink incorporating a vapor chamber and liquid cooling channel with outstanding thermal performance and hydraulic characteristics
•A hybrid vapor chamber heat sink with incorporating structure is proposed.•The active cooling channel is embedded in the vapor region of a vapor chamber.•The incorporating design weakens the temperature rise in the flow direction.•The heat sink realizes a high coefficient of performance under high...
Saved in:
| Published in | Energy conversion and management Vol. 244; p. 114499 |
|---|---|
| Main Authors | , , , , , , , , |
| Format | Journal Article |
| Language | English |
| Published |
Oxford
Elsevier Ltd
15.09.2021
Elsevier Science Ltd |
| Subjects | |
| Online Access | Get full text |
Cover
Loading…
| Abstract | •A hybrid vapor chamber heat sink with incorporating structure is proposed.•The active cooling channel is embedded in the vapor region of a vapor chamber.•The incorporating design weakens the temperature rise in the flow direction.•The heat sink realizes a high coefficient of performance under high heat input.
Facing higher and higher heat load and more rigorous limitations on energy consumption, conventional heat sinks and vapor chambers are falling short of new requirements. In this paper, a hybrid vapor chamber heat sink (HVCHS) of liquid cooling is developed, wherein the active liquid cooling channel is embedded in the vapor region of the vapor chamber so that two modes of heat transfer, phase change and single-phase heat transfer, are incorporated in a single device. The thermal performance, hydraulic characteristics, and cooling coefficient of performance (COP) of the HVCHS are investigated. The hybrid design provides a high cooling capacity of 1200 W using a 9 cm2 heater and maintains the maximum junction temperature of 95.25 °C simultaneously. The streamwise temperature rise is only 2.04 °C on the bottom surface under the maximum cooling capacity, which shows great temperature uniformity under high power. The minimum thermal resistance is as low as 0.04 °C/W and is compared with some previous studies. The minimum pressure drop is 4.83 kPa with the corresponding pump power of 80.5 mW. The cooling COP is above 12,500 for heat inputs of more than 850 W. The HVCHS may have great potential for the energy-saving cooling management of high-performance electronics. |
|---|---|
| AbstractList | Facing higher and higher heat load and more rigorous limitations on energy consumption, conventional heat sinks and vapor chambers are falling short of new requirements. In this paper, a hybrid vapor chamber heat sink (HVCHS) of liquid cooling is developed, wherein the active liquid cooling channel is embedded in the vapor region of the vapor chamber so that two modes of heat transfer, phase change and single-phase heat transfer, are incorporated in a single device. The thermal performance, hydraulic characteristics, and cooling coefficient of performance (COP) of the HVCHS are investigated. The hybrid design provides a high cooling capacity of 1200 W using a 9 cm2 heater and maintains the maximum junction temperature of 95.25 °C simultaneously. The streamwise temperature rise is only 2.04 °C on the bottom surface under the maximum cooling capacity, which shows great temperature uniformity under high power. The minimum thermal resistance is as low as 0.04 °C/W and is compared with some previous studies. The minimum pressure drop is 4.83 kPa with the corresponding pump power of 80.5 mW. The cooling COP is above 12,500 for heat inputs of more than 850 W. The HVCHS may have great potential for the energy-saving cooling management of high-performance electronics. •A hybrid vapor chamber heat sink with incorporating structure is proposed.•The active cooling channel is embedded in the vapor region of a vapor chamber.•The incorporating design weakens the temperature rise in the flow direction.•The heat sink realizes a high coefficient of performance under high heat input. Facing higher and higher heat load and more rigorous limitations on energy consumption, conventional heat sinks and vapor chambers are falling short of new requirements. In this paper, a hybrid vapor chamber heat sink (HVCHS) of liquid cooling is developed, wherein the active liquid cooling channel is embedded in the vapor region of the vapor chamber so that two modes of heat transfer, phase change and single-phase heat transfer, are incorporated in a single device. The thermal performance, hydraulic characteristics, and cooling coefficient of performance (COP) of the HVCHS are investigated. The hybrid design provides a high cooling capacity of 1200 W using a 9 cm2 heater and maintains the maximum junction temperature of 95.25 °C simultaneously. The streamwise temperature rise is only 2.04 °C on the bottom surface under the maximum cooling capacity, which shows great temperature uniformity under high power. The minimum thermal resistance is as low as 0.04 °C/W and is compared with some previous studies. The minimum pressure drop is 4.83 kPa with the corresponding pump power of 80.5 mW. The cooling COP is above 12,500 for heat inputs of more than 850 W. The HVCHS may have great potential for the energy-saving cooling management of high-performance electronics. |
| ArticleNumber | 114499 |
| Author | Luo, Yuhao Cai, Ruipeng Zhou, Guofu Bai, Pengfei Li, Shixiao Wang, Huawei Tang, Yifan Wu, Guodong Chen, Xingliang |
| Author_xml | – sequence: 1 givenname: Huawei surname: Wang fullname: Wang, Huawei organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 2 givenname: Pengfei surname: Bai fullname: Bai, Pengfei email: baipf@scnu.edu.cn organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 3 givenname: Ruipeng surname: Cai fullname: Cai, Ruipeng organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 4 givenname: Yuhao surname: Luo fullname: Luo, Yuhao organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 5 givenname: Xingliang surname: Chen fullname: Chen, Xingliang organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 6 givenname: Shixiao surname: Li fullname: Li, Shixiao organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 7 givenname: Guodong surname: Wu fullname: Wu, Guodong organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 8 givenname: Yifan surname: Tang fullname: Tang, Yifan organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China – sequence: 9 givenname: Guofu surname: Zhou fullname: Zhou, Guofu organization: Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou 510006, China |
| BookMark | eNqFkc2O1DAQhC20SMwuvAKyxDlDOz9OfGO1ggVpJS5wthy7Qzxk7Nm2s2jehYfFYeDChVO3VF9Vq1XX7CrEgIy9FrAXIOTbwx6DjeFowr6GWuyFaFulnrGdGHpV1XXdX7EdCCWrQUH7gl2ndACApgO5Yz9v-XweyTv-ZE6RuJ3NcUTiM5rMkw_fuS_hVCSTffjGzT-cCY4v_nEtATbGZUOKFAIu_IfPM49rTrlAm5BnpKNZ-AlpimULFn_757Mjsy7eblYyNiP5lL1NL9nzySwJX_2ZN-zrh_df7j5WD5_vP93dPlS27iFXRoAD2dtO2hFH1wxqcApq15mpbeToUHamN65XreucaybVTmpsYBpB4aBG1dywN5fcE8XHFVPWh7hSKCd13fWykQO0slDyQlmKKRFO-kT-aOisBeitCX3Qf5vQWxP60kQxvrsYsfzw5JF0sr6Q6DyhzdpF_7-IX6ysm-I |
| CitedBy_id | crossref_primary_10_1016_j_icheatmasstransfer_2022_106478 crossref_primary_10_1016_j_applthermaleng_2023_120654 crossref_primary_10_18186_thermal_1448547 crossref_primary_10_1016_j_ijheatmasstransfer_2023_124675 crossref_primary_10_1021_acs_langmuir_4c00255 crossref_primary_10_1016_j_applthermaleng_2023_121927 crossref_primary_10_1016_j_enconman_2021_115138 crossref_primary_10_1016_j_ijmecsci_2022_107338 crossref_primary_10_1007_s10765_023_03308_w crossref_primary_10_1016_j_ijheatmasstransfer_2022_123737 crossref_primary_10_1016_j_cej_2022_140793 crossref_primary_10_1016_j_enconman_2022_115293 crossref_primary_10_1016_j_csite_2021_101503 crossref_primary_10_1016_j_csite_2023_103535 crossref_primary_10_1016_j_applthermaleng_2023_122162 crossref_primary_10_1016_j_ijheatmasstransfer_2024_125814 crossref_primary_10_1016_j_ijmecsci_2021_107045 |
| Cites_doi | 10.1016/j.expthermflusci.2020.110141 10.1016/j.expthermflusci.2017.01.016 10.1016/j.csite.2020.100590 10.1016/j.enconman.2019.112202 10.1016/j.applthermaleng.2017.10.098 10.1016/j.enconman.2021.114017 10.1016/j.ijheatmasstransfer.2020.120395 10.1016/j.expthermflusci.2020.110211 10.2172/1372902 10.1016/j.ijheatmasstransfer.2018.11.040 10.1016/j.expthermflusci.2020.110285 10.1016/j.ijheatmasstransfer.2019.118846 10.1016/j.applthermaleng.2015.01.015 10.1016/j.icheatmasstransfer.2015.04.005 10.1016/j.icheatmasstransfer.2018.03.003 10.1016/j.expthermflusci.2017.03.008 10.1016/j.applthermaleng.2019.113816 10.1016/j.enconman.2018.11.031 10.1016/j.applthermaleng.2018.03.089 10.1016/j.ijheatmasstransfer.2018.07.029 10.1016/j.ijthermalsci.2018.06.035 10.1016/j.csite.2020.100587 10.1016/j.enconman.2015.01.004 10.1038/s41586-020-2666-1 10.1016/j.applthermaleng.2020.115540 10.1016/j.jclepro.2019.119663 10.1016/j.ijheatmasstransfer.2020.119575 10.1016/j.ijthermalsci.2020.106791 10.1109/SmartWorld-UIC-ATC-SCALCOM-IOP-SCI.2019.00088 10.1016/j.energy.2020.119223 10.1016/j.ijheatmasstransfer.2019.118458 10.1016/j.cep.2020.108066 10.1016/j.applthermaleng.2019.114890 10.1016/j.ijheatmasstransfer.2020.120141 10.1016/j.ijthermalsci.2017.05.013 10.1109/EDL.1981.25367 10.1016/j.ijthermalsci.2020.106727 10.1016/j.ijheatmasstransfer.2020.120633 10.1016/j.applthermaleng.2016.04.073 10.1016/j.applthermaleng.2013.02.034 |
| ContentType | Journal Article |
| Copyright | 2021 Elsevier Ltd Copyright Elsevier Science Ltd. Sep 15, 2021 |
| Copyright_xml | – notice: 2021 Elsevier Ltd – notice: Copyright Elsevier Science Ltd. Sep 15, 2021 |
| DBID | AAYXX CITATION 7ST 7TB 8FD C1K FR3 H8D KR7 L7M SOI |
| DOI | 10.1016/j.enconman.2021.114499 |
| DatabaseName | CrossRef Environment Abstracts Mechanical & Transportation Engineering Abstracts Technology Research Database Environmental Sciences and Pollution Management Engineering Research Database Aerospace Database Civil Engineering Abstracts Advanced Technologies Database with Aerospace Environment Abstracts |
| DatabaseTitle | CrossRef Aerospace Database Civil Engineering Abstracts Technology Research Database Mechanical & Transportation Engineering Abstracts Engineering Research Database Environment Abstracts Advanced Technologies Database with Aerospace Environmental Sciences and Pollution Management |
| DatabaseTitleList | Aerospace Database |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Engineering |
| EISSN | 1879-2227 |
| ExternalDocumentID | 10_1016_j_enconman_2021_114499 S0196890421006750 |
| GroupedDBID | --K --M .DC .~1 0R~ 1B1 1~. 1~5 4.4 457 4G. 5GY 5VS 7-5 71M 8P~ 9JN AABNK AACTN AAEDT AAEDW AAHCO AAIAV AAIKJ AAKOC AALRI AAOAW AAQFI AARJD AAXUO ABFNM ABFRF ABJNI ABMAC ABYKQ ACBEA ACDAQ ACGFO ACGFS ACIWK ACNCT ACRLP ADBBV ADEZE AEBSH AEFWE AEKER AENEX AFKWA AFRAH AFTJW AGHFR AGUBO AGYEJ AHHHB AHIDL AHJVU AIEXJ AIKHN AITUG AJOXV ALMA_UNASSIGNED_HOLDINGS AMFUW AMRAJ AXJTR BELTK BJAXD BKOJK BLXMC CS3 DU5 EBS EFJIC EFLBG EO8 EO9 EP2 EP3 FDB FIRID FNPLU FYGXN G-Q GBLVA IHE J1W JARJE KOM LY6 M41 MO0 N9A O-L O9- OAUVE OZT P-8 P-9 P2P PC. Q38 ROL RPZ SDF SDG SDP SES SPC SPCBC SSR SST SSZ T5K TN5 XPP ZMT ~02 ~G- 29G 6TJ 8WZ A6W AAHBH AAQXK AAXKI AAYXX ABXDB ACNNM ADMUD AFFNX AFJKZ AKRWK ASPBG AVWKF AZFZN CITATION EJD FEDTE FGOYB G-2 G8K HVGLF HZ~ H~9 R2- RIG SAC SEW WUQ 7ST 7TB 8FD C1K FR3 H8D KR7 L7M SOI |
| ID | FETCH-LOGICAL-c270t-a10d067c56cbebd3898d902d5af436bde65a7ad794d5dd3f94f9b30fb09e89b93 |
| IEDL.DBID | .~1 |
| ISSN | 0196-8904 |
| IngestDate | Wed Sep 25 00:57:52 EDT 2024 Thu Sep 26 16:54:43 EDT 2024 Fri Feb 23 02:42:37 EST 2024 |
| IsPeerReviewed | true |
| IsScholarly | true |
| Keywords | Heat transfer enhancement Hybrid design Energy saving Vapor chamber Heat sink |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-LOGICAL-c270t-a10d067c56cbebd3898d902d5af436bde65a7ad794d5dd3f94f9b30fb09e89b93 |
| PQID | 2576368046 |
| PQPubID | 2047472 |
| ParticipantIDs | proquest_journals_2576368046 crossref_primary_10_1016_j_enconman_2021_114499 elsevier_sciencedirect_doi_10_1016_j_enconman_2021_114499 |
| PublicationCentury | 2000 |
| PublicationDate | 2021-09-15 |
| PublicationDateYYYYMMDD | 2021-09-15 |
| PublicationDate_xml | – month: 09 year: 2021 text: 2021-09-15 day: 15 |
| PublicationDecade | 2020 |
| PublicationPlace | Oxford |
| PublicationPlace_xml | – name: Oxford |
| PublicationTitle | Energy conversion and management |
| PublicationYear | 2021 |
| Publisher | Elsevier Ltd Elsevier Science Ltd |
| Publisher_xml | – name: Elsevier Ltd – name: Elsevier Science Ltd |
| References | Li, Guo, Huang (b0060) 2020; 146 Morisaki, Minami, Miyazaki, Yabuki (b0045) 2021; 121 Yang, Xue, He, Li (b0090) 2017; 83 Wang, Bai, Zhou, Coehoorn, Li, Liao (b0180) 2019; 159 Chuan, Wang, Wang, Yan (b0110) 2015; 65 Sun, Liebersbach, Qian (b0065) 2020; 178 Leng, Wang, Wang (b0150) 2015; 79 Wang, Zhao, Xu, Li, Deng (b0165) 2019; 142 Gilmore, Timchenko, Menictas (b0035) 2020; 163 Kealy (b0020) 2020; 251 Wu, Luo, Bai, Wang, Cai, Tang (b0200) 2021; 235 Wang, Li, Wang, Lu (b0140) 2018; 93 Tsai, Kang, Vieira de Paiva (b0175) 2013; 56 Ansari, Zhou (b0080) 2020; 156 Gnielinski (b0195) 1976 Leng, Wang, Wang, Yan (b0120) 2015; 93 Shen, Zhang, Wang, Xie (b0130) 2018; 137 He, Yan, Zhang (b0030) 2021; 216 Abo-Zahhad, Ookawara, Radwan, Elkady, El-Shazly (b0070) 2020; 18 U. Lopez-Novoa, Exploring Performance and Energy Consumption Differences between Recent Intel Processors, in: 2019 IEEE SmartWorld, Ubiquitous Intelligence & Computing, Advanced & Trusted Computing, Scalable Computing & Communications, Cloud & Big Data Computing, Internet of People and Smart City Innovation (SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI), 2019, pp. 263-267. Cao, Liu, Shao, Shen, Xie (b0095) 2020; 153 Spizzichino, Sinibaldi, Romano (b0015) 2020; 118 Lu, Yang, Zhai, Wang (b0055) 2021; 161 Ermagan, Rafee (b0105) 2018; 132 Jafari, Wits, Geurts (b0185) 2020; 168 Chi S. Heat pipe theory and practice, Washington; 1976. van Erp, Soleimanzadeh, Nela, Kampitsis, Matioli (b0005) 2020; 585 Srivastava, Patel, Dewan (b0115) 2021; 162 Soleymani, Rahimi, Gorzin, Pahamli (b0050) 2020; 159 Zhou, Li, Chen, Deng, Gan (b0205) 2019; 180 Ji, Li, Xu, Huang (b0170) 2017; 85 Lin, Zhao, Lu, Wang, Yan (b0075) 2017; 118 Wiriyasart, Naphon (b0210) 2018; 127 Osanloo, Mohammadi-Ahmar, Solati, Baghani (b0145) 2016; 102 Patel, Mehta (b0125) 2021; 165 Ghahremannezhad, Xu, Alhuyi Nazari, Hossein Ahmadi, Vafai (b0135) 2019; 131 Li, Lv, Zhou, Li (b0160) 2019; 201 Tuckerman, Pease (b0040) 1981; 2 Kheirabadi, Groulx (b0085) 2018; 129 A. Shehabi, S. Smith, D. Sartor, R. Brown, M. Herrlin, J. Koomey, E. Masanet, N. Horner, I. Azevedo, W. Lintner, United states data center energy usage report, (2016). Vilkinis, Pedišius (b0100) 2020; 119 Wiriyasart, Naphon (b0155) 2020; 18 Wang (10.1016/j.enconman.2021.114499_b0165) 2019; 142 Jafari (10.1016/j.enconman.2021.114499_b0185) 2020; 168 Tsai (10.1016/j.enconman.2021.114499_b0175) 2013; 56 Soleymani (10.1016/j.enconman.2021.114499_b0050) 2020; 159 Gnielinski (10.1016/j.enconman.2021.114499_b0195) 1976 Chuan (10.1016/j.enconman.2021.114499_b0110) 2015; 65 Ghahremannezhad (10.1016/j.enconman.2021.114499_b0135) 2019; 131 10.1016/j.enconman.2021.114499_b0190 Tuckerman (10.1016/j.enconman.2021.114499_b0040) 1981; 2 Cao (10.1016/j.enconman.2021.114499_b0095) 2020; 153 Ermagan (10.1016/j.enconman.2021.114499_b0105) 2018; 132 Ji (10.1016/j.enconman.2021.114499_b0170) 2017; 85 Sun (10.1016/j.enconman.2021.114499_b0065) 2020; 178 Shen (10.1016/j.enconman.2021.114499_b0130) 2018; 137 Srivastava (10.1016/j.enconman.2021.114499_b0115) 2021; 162 Wang (10.1016/j.enconman.2021.114499_b0180) 2019; 159 Lin (10.1016/j.enconman.2021.114499_b0075) 2017; 118 Leng (10.1016/j.enconman.2021.114499_b0120) 2015; 93 Patel (10.1016/j.enconman.2021.114499_b0125) 2021; 165 Wiriyasart (10.1016/j.enconman.2021.114499_b0210) 2018; 127 Wang (10.1016/j.enconman.2021.114499_b0140) 2018; 93 Ansari (10.1016/j.enconman.2021.114499_b0080) 2020; 156 Osanloo (10.1016/j.enconman.2021.114499_b0145) 2016; 102 Vilkinis (10.1016/j.enconman.2021.114499_b0100) 2020; 119 Wiriyasart (10.1016/j.enconman.2021.114499_b0155) 2020; 18 10.1016/j.enconman.2021.114499_b0025 Leng (10.1016/j.enconman.2021.114499_b0150) 2015; 79 Wu (10.1016/j.enconman.2021.114499_b0200) 2021; 235 Kheirabadi (10.1016/j.enconman.2021.114499_b0085) 2018; 129 Kealy (10.1016/j.enconman.2021.114499_b0020) 2020; 251 He (10.1016/j.enconman.2021.114499_b0030) 2021; 216 Zhou (10.1016/j.enconman.2021.114499_b0205) 2019; 180 10.1016/j.enconman.2021.114499_b0010 Li (10.1016/j.enconman.2021.114499_b0060) 2020; 146 Yang (10.1016/j.enconman.2021.114499_b0090) 2017; 83 van Erp (10.1016/j.enconman.2021.114499_b0005) 2020; 585 Lu (10.1016/j.enconman.2021.114499_b0055) 2021; 161 Gilmore (10.1016/j.enconman.2021.114499_b0035) 2020; 163 Morisaki (10.1016/j.enconman.2021.114499_b0045) 2021; 121 Spizzichino (10.1016/j.enconman.2021.114499_b0015) 2020; 118 Abo-Zahhad (10.1016/j.enconman.2021.114499_b0070) 2020; 18 Li (10.1016/j.enconman.2021.114499_b0160) 2019; 201 |
| References_xml | – volume: 235 year: 2021 ident: b0200 article-title: Modeling and experimental analysis of an internally-cooled vapor chamber publication-title: Energy Convers Manage contributor: fullname: Tang – volume: 93 start-page: 141 year: 2015 end-page: 150 ident: b0120 article-title: Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink publication-title: Energy Convers Manage contributor: fullname: Yan – volume: 162 year: 2021 ident: b0115 article-title: A study on thermal characteristics of double-layered microchannel heat sink: effects of bifurcation and flow configuration publication-title: Int J Therm Sci contributor: fullname: Dewan – volume: 137 start-page: 228 year: 2018 end-page: 237 ident: b0130 article-title: Comparative study for convective heat transfer of counter-flow wavy double-layer microchannel heat sinks in staggered arrangement publication-title: Appl Therm Eng contributor: fullname: Xie – volume: 159 year: 2019 ident: b0180 article-title: An integrated heat pipe coupling the vapor chamber and two cylindrical heat pipes with high anti-gravity thermal performance publication-title: Appl Therm Eng contributor: fullname: Liao – volume: 127 start-page: 164 year: 2018 end-page: 171 ident: b0210 article-title: Fill ratio effects on vapor chamber thermal resistance with different configuration structures publication-title: Int J Heat Mass Transf contributor: fullname: Naphon – volume: 18 year: 2020 ident: b0155 article-title: Thermal management system with different configuration liquid vapor chambers for high power electronic devices publication-title: Case Stud Therm Eng contributor: fullname: Naphon – volume: 161 year: 2021 ident: b0055 article-title: Hotspot thermal management in microchannel heat sinks with vortex generators publication-title: Int J Therm Sci contributor: fullname: Wang – volume: 163 start-page: 120395 year: 2020 ident: b0035 article-title: Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop publication-title: Int J Heat Mass Transf contributor: fullname: Menictas – volume: 180 start-page: 769 year: 2019 end-page: 783 ident: b0205 article-title: A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices publication-title: Energy Convers Manage contributor: fullname: Gan – volume: 56 start-page: 38 year: 2013 end-page: 44 ident: b0175 article-title: Experimental studies of thermal resistance in a vapor chamber heat spreader publication-title: Appl Therm Eng contributor: fullname: Vieira de Paiva – volume: 121 start-page: 110285 year: 2021 ident: b0045 article-title: Direct local heat flux measurement during water flow boiling in a rectangular minichannel using a MEMS heat flux sensor publication-title: Exp Therm Fluid Sci contributor: fullname: Yabuki – volume: 142 year: 2019 ident: b0165 article-title: Numerical analysis on the thermal hydraulic performance of a composite porous vapor chamber with uniform radial grooves publication-title: Int J Heat Mass Transf contributor: fullname: Deng – volume: 118 start-page: 423 year: 2017 end-page: 434 ident: b0075 article-title: Heat transfer enhancement in microchannel heat sink by wavy channel with changing wavelength/amplitude publication-title: Int J Therm Sci contributor: fullname: Yan – volume: 129 start-page: 1010 year: 2018 end-page: 1025 ident: b0085 article-title: Experimental evaluation of a thermal contact liquid cooling system for server electronics publication-title: Appl Therm Eng contributor: fullname: Groulx – volume: 119 start-page: 110211 year: 2020 ident: b0100 article-title: Analysis of reattachment length dynamics in cavities publication-title: Exp Therm Fluid Sci contributor: fullname: Pedišius – volume: 146 year: 2020 ident: b0060 article-title: Heat transfer enhancement, entropy generation and temperature uniformity analyses of shark-skin bionic modified microchannel heat sink publication-title: Int J Heat Mass Transf contributor: fullname: Huang – volume: 165 year: 2021 ident: b0125 article-title: Experimental investigations on a variable channel width double layered minichannel heat sink publication-title: Int J Heat Mass Transf contributor: fullname: Mehta – volume: 201 year: 2019 ident: b0160 article-title: Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips publication-title: Energy Convers Manage contributor: fullname: Li – volume: 178 year: 2020 ident: b0065 article-title: 3D topology optimization of heat sinks for liquid cooling publication-title: Appl Therm Eng contributor: fullname: Qian – volume: 153 year: 2020 ident: b0095 article-title: Thermal performance of double serpentine minichannel heat sinks: Effects of inlet-outlet arrangements and through-holes publication-title: Int J Heat Mass Transf contributor: fullname: Xie – year: 1976 ident: b0195 article-title: New Equations for Heat and Mass Transfer in Turbulent Pipe and Channel Flows[J] contributor: fullname: Gnielinski – volume: 132 start-page: 578 year: 2018 end-page: 588 ident: b0105 article-title: Numerical investigation into the thermo-fluid performance of wavy microchannels with superhydrophobic walls publication-title: Int J Therm Sci contributor: fullname: Rafee – volume: 2 start-page: 126 year: 1981 end-page: 129 ident: b0040 article-title: High-performance heat sinking for VLSI publication-title: IEEE Electron Device Lett contributor: fullname: Pease – volume: 83 start-page: 248 year: 2017 end-page: 259 ident: b0090 article-title: Experimental study on the heat transfer characteristics of high blockage ribs channel publication-title: Exp Therm Fluid Sci contributor: fullname: Li – volume: 118 year: 2020 ident: b0015 article-title: Experimental investigation on fluid mechanics of micro-channel heat transfer devices publication-title: Exp Therm Fluid Sci contributor: fullname: Romano – volume: 585 start-page: 211 year: 2020 end-page: 216 ident: b0005 article-title: Co-designing electronics with microfluidics for more sustainable cooling publication-title: Nature contributor: fullname: Matioli – volume: 168 year: 2020 ident: b0185 article-title: Phase change heat transfer characteristics of an additively manufactured wick for heat pipe applications publication-title: Appl Therm Eng contributor: fullname: Geurts – volume: 102 start-page: 1345 year: 2016 end-page: 1354 ident: b0145 article-title: Performance enhancement of the double-layered micro-channel heat sink by use of tapered channels publication-title: Appl Therm Eng contributor: fullname: Baghani – volume: 18 year: 2020 ident: b0070 article-title: Optimization of stepwise varying width microchannel heat sink for high heat flux applications publication-title: Case Studies in Thermal Engineering contributor: fullname: El-Shazly – volume: 85 start-page: 119 year: 2017 end-page: 131 ident: b0170 article-title: Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices publication-title: Exp Therm Fluid Sci contributor: fullname: Huang – volume: 251 year: 2020 ident: b0020 article-title: A closed-loop renewable energy evaluation framework publication-title: J Cleaner Prod contributor: fullname: Kealy – volume: 79 start-page: 54 year: 2015 end-page: 62 ident: b0150 article-title: An improved design of double-layered microchannel heat sink with truncated top channels publication-title: Appl Therm Eng contributor: fullname: Wang – volume: 156 start-page: 108066 year: 2020 ident: b0080 article-title: Flow and heat transfer analysis of microchannels structured with rectangular surface roughness publication-title: Chemical Engineering and Processing - Process Intensification contributor: fullname: Zhou – volume: 65 start-page: 52 year: 2015 end-page: 57 ident: b0110 article-title: Fluid flow and heat transfer in microchannel heat sink based on porous fin design concept publication-title: Int Commun Heat Mass Transfer contributor: fullname: Yan – volume: 131 start-page: 52 year: 2019 end-page: 63 ident: b0135 article-title: Effect of porous substrates on thermohydraulic performance enhancement of double layer microchannel heat sinks publication-title: Int J Heat Mass Transf contributor: fullname: Vafai – volume: 93 start-page: 41 year: 2018 end-page: 47 ident: b0140 article-title: Flow and heat transfer characteristics in double-layered microchannel heat sinks with porous fins publication-title: Int Commun Heat Mass Transfer contributor: fullname: Lu – volume: 216 start-page: 119223 year: 2021 ident: b0030 article-title: Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review publication-title: Energy contributor: fullname: Zhang – volume: 159 start-page: 120141 year: 2020 ident: b0050 article-title: Performance analysis of hotspot using geometrical and operational parameters of a microchannel pin-fin hybrid heat sink publication-title: Int J Heat Mass Transf contributor: fullname: Pahamli – volume: 118 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0015 article-title: Experimental investigation on fluid mechanics of micro-channel heat transfer devices publication-title: Exp Therm Fluid Sci doi: 10.1016/j.expthermflusci.2020.110141 contributor: fullname: Spizzichino – volume: 83 start-page: 248 year: 2017 ident: 10.1016/j.enconman.2021.114499_b0090 article-title: Experimental study on the heat transfer characteristics of high blockage ribs channel publication-title: Exp Therm Fluid Sci doi: 10.1016/j.expthermflusci.2017.01.016 contributor: fullname: Yang – volume: 18 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0155 article-title: Thermal management system with different configuration liquid vapor chambers for high power electronic devices publication-title: Case Stud Therm Eng doi: 10.1016/j.csite.2020.100590 contributor: fullname: Wiriyasart – volume: 201 year: 2019 ident: 10.1016/j.enconman.2021.114499_b0160 article-title: Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips publication-title: Energy Convers Manage doi: 10.1016/j.enconman.2019.112202 contributor: fullname: Li – volume: 129 start-page: 1010 year: 2018 ident: 10.1016/j.enconman.2021.114499_b0085 article-title: Experimental evaluation of a thermal contact liquid cooling system for server electronics publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2017.10.098 contributor: fullname: Kheirabadi – volume: 235 year: 2021 ident: 10.1016/j.enconman.2021.114499_b0200 article-title: Modeling and experimental analysis of an internally-cooled vapor chamber publication-title: Energy Convers Manage doi: 10.1016/j.enconman.2021.114017 contributor: fullname: Wu – volume: 163 start-page: 120395 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0035 article-title: Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2020.120395 contributor: fullname: Gilmore – volume: 119 start-page: 110211 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0100 article-title: Analysis of reattachment length dynamics in cavities publication-title: Exp Therm Fluid Sci doi: 10.1016/j.expthermflusci.2020.110211 contributor: fullname: Vilkinis – ident: 10.1016/j.enconman.2021.114499_b0010 doi: 10.2172/1372902 – volume: 131 start-page: 52 year: 2019 ident: 10.1016/j.enconman.2021.114499_b0135 article-title: Effect of porous substrates on thermohydraulic performance enhancement of double layer microchannel heat sinks publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2018.11.040 contributor: fullname: Ghahremannezhad – volume: 121 start-page: 110285 year: 2021 ident: 10.1016/j.enconman.2021.114499_b0045 article-title: Direct local heat flux measurement during water flow boiling in a rectangular minichannel using a MEMS heat flux sensor publication-title: Exp Therm Fluid Sci doi: 10.1016/j.expthermflusci.2020.110285 contributor: fullname: Morisaki – volume: 146 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0060 article-title: Heat transfer enhancement, entropy generation and temperature uniformity analyses of shark-skin bionic modified microchannel heat sink publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2019.118846 contributor: fullname: Li – volume: 79 start-page: 54 year: 2015 ident: 10.1016/j.enconman.2021.114499_b0150 article-title: An improved design of double-layered microchannel heat sink with truncated top channels publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2015.01.015 contributor: fullname: Leng – volume: 65 start-page: 52 year: 2015 ident: 10.1016/j.enconman.2021.114499_b0110 article-title: Fluid flow and heat transfer in microchannel heat sink based on porous fin design concept publication-title: Int Commun Heat Mass Transfer doi: 10.1016/j.icheatmasstransfer.2015.04.005 contributor: fullname: Chuan – volume: 93 start-page: 41 year: 2018 ident: 10.1016/j.enconman.2021.114499_b0140 article-title: Flow and heat transfer characteristics in double-layered microchannel heat sinks with porous fins publication-title: Int Commun Heat Mass Transfer doi: 10.1016/j.icheatmasstransfer.2018.03.003 contributor: fullname: Wang – volume: 85 start-page: 119 year: 2017 ident: 10.1016/j.enconman.2021.114499_b0170 article-title: Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices publication-title: Exp Therm Fluid Sci doi: 10.1016/j.expthermflusci.2017.03.008 contributor: fullname: Ji – volume: 159 year: 2019 ident: 10.1016/j.enconman.2021.114499_b0180 article-title: An integrated heat pipe coupling the vapor chamber and two cylindrical heat pipes with high anti-gravity thermal performance publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2019.113816 contributor: fullname: Wang – volume: 180 start-page: 769 year: 2019 ident: 10.1016/j.enconman.2021.114499_b0205 article-title: A novel ultra-thin flattened heat pipe with biporous spiral woven mesh wick for cooling electronic devices publication-title: Energy Convers Manage doi: 10.1016/j.enconman.2018.11.031 contributor: fullname: Zhou – volume: 137 start-page: 228 year: 2018 ident: 10.1016/j.enconman.2021.114499_b0130 article-title: Comparative study for convective heat transfer of counter-flow wavy double-layer microchannel heat sinks in staggered arrangement publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2018.03.089 contributor: fullname: Shen – volume: 127 start-page: 164 year: 2018 ident: 10.1016/j.enconman.2021.114499_b0210 article-title: Fill ratio effects on vapor chamber thermal resistance with different configuration structures publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2018.07.029 contributor: fullname: Wiriyasart – volume: 132 start-page: 578 year: 2018 ident: 10.1016/j.enconman.2021.114499_b0105 article-title: Numerical investigation into the thermo-fluid performance of wavy microchannels with superhydrophobic walls publication-title: Int J Therm Sci doi: 10.1016/j.ijthermalsci.2018.06.035 contributor: fullname: Ermagan – volume: 18 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0070 article-title: Optimization of stepwise varying width microchannel heat sink for high heat flux applications publication-title: Case Studies in Thermal Engineering doi: 10.1016/j.csite.2020.100587 contributor: fullname: Abo-Zahhad – volume: 93 start-page: 141 year: 2015 ident: 10.1016/j.enconman.2021.114499_b0120 article-title: Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink publication-title: Energy Convers Manage doi: 10.1016/j.enconman.2015.01.004 contributor: fullname: Leng – volume: 585 start-page: 211 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0005 article-title: Co-designing electronics with microfluidics for more sustainable cooling publication-title: Nature doi: 10.1038/s41586-020-2666-1 contributor: fullname: van Erp – volume: 178 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0065 article-title: 3D topology optimization of heat sinks for liquid cooling publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2020.115540 contributor: fullname: Sun – volume: 251 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0020 article-title: A closed-loop renewable energy evaluation framework publication-title: J Cleaner Prod doi: 10.1016/j.jclepro.2019.119663 contributor: fullname: Kealy – volume: 153 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0095 article-title: Thermal performance of double serpentine minichannel heat sinks: Effects of inlet-outlet arrangements and through-holes publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2020.119575 contributor: fullname: Cao – volume: 162 year: 2021 ident: 10.1016/j.enconman.2021.114499_b0115 article-title: A study on thermal characteristics of double-layered microchannel heat sink: effects of bifurcation and flow configuration publication-title: Int J Therm Sci doi: 10.1016/j.ijthermalsci.2020.106791 contributor: fullname: Srivastava – year: 1976 ident: 10.1016/j.enconman.2021.114499_b0195 contributor: fullname: Gnielinski – ident: 10.1016/j.enconman.2021.114499_b0025 doi: 10.1109/SmartWorld-UIC-ATC-SCALCOM-IOP-SCI.2019.00088 – volume: 216 start-page: 119223 year: 2021 ident: 10.1016/j.enconman.2021.114499_b0030 article-title: Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review publication-title: Energy doi: 10.1016/j.energy.2020.119223 contributor: fullname: He – volume: 142 year: 2019 ident: 10.1016/j.enconman.2021.114499_b0165 article-title: Numerical analysis on the thermal hydraulic performance of a composite porous vapor chamber with uniform radial grooves publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2019.118458 contributor: fullname: Wang – volume: 156 start-page: 108066 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0080 article-title: Flow and heat transfer analysis of microchannels structured with rectangular surface roughness publication-title: Chemical Engineering and Processing - Process Intensification doi: 10.1016/j.cep.2020.108066 contributor: fullname: Ansari – volume: 168 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0185 article-title: Phase change heat transfer characteristics of an additively manufactured wick for heat pipe applications publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2019.114890 contributor: fullname: Jafari – volume: 159 start-page: 120141 year: 2020 ident: 10.1016/j.enconman.2021.114499_b0050 article-title: Performance analysis of hotspot using geometrical and operational parameters of a microchannel pin-fin hybrid heat sink publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2020.120141 contributor: fullname: Soleymani – volume: 118 start-page: 423 year: 2017 ident: 10.1016/j.enconman.2021.114499_b0075 article-title: Heat transfer enhancement in microchannel heat sink by wavy channel with changing wavelength/amplitude publication-title: Int J Therm Sci doi: 10.1016/j.ijthermalsci.2017.05.013 contributor: fullname: Lin – volume: 2 start-page: 126 issue: 5 year: 1981 ident: 10.1016/j.enconman.2021.114499_b0040 article-title: High-performance heat sinking for VLSI publication-title: IEEE Electron Device Lett doi: 10.1109/EDL.1981.25367 contributor: fullname: Tuckerman – ident: 10.1016/j.enconman.2021.114499_b0190 – volume: 161 year: 2021 ident: 10.1016/j.enconman.2021.114499_b0055 article-title: Hotspot thermal management in microchannel heat sinks with vortex generators publication-title: Int J Therm Sci doi: 10.1016/j.ijthermalsci.2020.106727 contributor: fullname: Lu – volume: 165 year: 2021 ident: 10.1016/j.enconman.2021.114499_b0125 article-title: Experimental investigations on a variable channel width double layered minichannel heat sink publication-title: Int J Heat Mass Transf doi: 10.1016/j.ijheatmasstransfer.2020.120633 contributor: fullname: Patel – volume: 102 start-page: 1345 year: 2016 ident: 10.1016/j.enconman.2021.114499_b0145 article-title: Performance enhancement of the double-layered micro-channel heat sink by use of tapered channels publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2016.04.073 contributor: fullname: Osanloo – volume: 56 start-page: 38 year: 2013 ident: 10.1016/j.enconman.2021.114499_b0175 article-title: Experimental studies of thermal resistance in a vapor chamber heat spreader publication-title: Appl Therm Eng doi: 10.1016/j.applthermaleng.2013.02.034 contributor: fullname: Tsai |
| SSID | ssj0003506 |
| Score | 2.4822257 |
| Snippet | •A hybrid vapor chamber heat sink with incorporating structure is proposed.•The active cooling channel is embedded in the vapor region of a vapor chamber.•The... Facing higher and higher heat load and more rigorous limitations on energy consumption, conventional heat sinks and vapor chambers are falling short of new... |
| SourceID | proquest crossref elsevier |
| SourceType | Aggregation Database Publisher |
| StartPage | 114499 |
| SubjectTerms | Chambers Cooling Energy conservation Energy consumption Energy saving Heat Heat sink Heat sinks Heat transfer Heat transfer enhancement Hybrid design Hydraulic loading Liquid cooling Pressure drop Thermal resistance Vapor chamber Vapors |
| Title | A hybrid vapor chamber heat sink incorporating a vapor chamber and liquid cooling channel with outstanding thermal performance and hydraulic characteristics |
| URI | https://dx.doi.org/10.1016/j.enconman.2021.114499 https://www.proquest.com/docview/2576368046/abstract/ |
| Volume | 244 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV1LT8MwDI4muMAB8RSPgXLgWtY2Sdccpwk0QHCBSdyiPBo2BN3YA2kXfgk_FrsPMRASB45t7SiyHdup7M-EnEobGc-lD6yH9I2nJgog7phAQyiJY5umzGOj8M1t0uvzqwfx0CDduhcGyyor31_69MJbV29alTRb4-GwdYfILqkEo4vQ5Rb3dg7BCGz67P2rzIOJYr4mEgdIvdQl_HSGWJH5i0Yc1DhC2FxeYMD-GqB-uOoi_lxsko0qcaSdcm9bpJHl22R9CU5wh3x06GCBHVj0TUNaTe1A47gPiv6WTuHSSRGKoUQuBgaqf9Dp3NHn4escFrAjHObziJ-wEIbi71o6ms_qNhiKeeML7Gf81XhQ8A8WbqLnz0OLrMtQ0Lukf3F-3-0F1fSFwMbtcBboKHQgVysSazLjILFJnQxjJ7TnLDEuS4Ruawfn2QnnmJfcS8NCb0KZpdJItkdW8lGe7RPKYpd4Cb5EgoRjG0vLhc_aziPYkDDsgLRqkatxCbKh6uqzJ1UrSaGSVKmkAyJrzahv5qIgEvzJ26xVqaoDO1V472JJGvLk8B9LH5E1fMJ6kkg0ycpsMs-OIWmZmZPCKk_Iaufyunf7CfQQ8Kg |
| link.rule.ids | 315,786,790,4521,24144,27957,27958,45620,45714 |
| linkProvider | Elsevier |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV07T8MwELZQOwAD4ikKBTywhiaxncZjhUDl1QWQ2Cw_YlrUpqVtkPpf-LH48oCCkBhYY59l3dnfnaO77xA65TpQlnLraevCNxqrwHN-R3nSuZIw1HFMLBQK3_Wi7iO9fmJPK-i8qoWBtMoS-wtMz9G6_NIqtdmaDAate2B2ibk7dAFALrzb65S1A1pD9c7VTbf3CciE5S02Yb4HAkuFwi9nQBeZjiRQoYYBMOfSnAb2Vx_1A61zF3S5iTbK2BF3iu1toZUk3UbrS4yCO-i9g_sLKMLCb9JF1lj3JXT8wAC5eObenRjYGAryYieA5Y95MjV4OHjN3AJ6DP18nmEIcmEw_LHF42xeVcJgCB1Hbj-Tr9qDXL6_MFOZDQcaRJfZoHfR4-XFw3nXKxsweDps-3NPBr5xqtUs0ipRxsU2seF-aJi0lETKJBGTbWnclTbMGGI5tVwR3yqfJzFXnOyhWjpOk32ESWgiyx2ccKfhUIdcU2aTtrHAN8QUaaBWpXIxKXg2RJWA9iIqIwkwkiiM1EC8soz4dmKEcwZ_yjYrU4ryzs4EPL1IFPs0OvjH0idotftwdytur3o3h2gNRiC9JGBNVJtPs-TIxTBzdVye0Q83QvNe |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=A+hybrid+vapor+chamber+heat+sink+incorporating+a+vapor+chamber+and+liquid+cooling+channel+with+outstanding+thermal+performance+and+hydraulic+characteristics&rft.jtitle=Energy+conversion+and+management&rft.au=Wang%2C+Huawei&rft.au=Bai%2C+Pengfei&rft.au=Cai%2C+Ruipeng&rft.au=Luo%2C+Yuhao&rft.date=2021-09-15&rft.issn=0196-8904&rft.volume=244&rft.spage=114499&rft_id=info:doi/10.1016%2Fj.enconman.2021.114499&rft.externalDBID=n%2Fa&rft.externalDocID=10_1016_j_enconman_2021_114499 |
| thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0196-8904&client=summon |
| thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0196-8904&client=summon |
| thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0196-8904&client=summon |