Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 5; no. 10; pp. 1432 - 1440
• Main Authors: Myers, John N., Xiaoxian Zhang, Yonghao Xiu, Yuying Wei, Williamson, Jaimal M., Kang-Wook Lee, Zhan Chen
• Format: Journal Article
• Language: English
• Published: IEEE 01.10.2015
• Subjects: Adhesives; Copper; Delamination; Failure analysis; interface phenomena; nonlinear optics; Polymers; spectroscopy; Substrates; Surface morphology; nonlinear optics; spectroscopy; interface phenomena; Failure analysis

Delamination at heterogeneous metal/polymer interfaces during reliability testing of packaged devices continues to be a reliability issue in microelectronic packaging. Although interfacial adhesion properties are largely determined by molecular structures at buried interfaces, structure-property rel...