APA (7th ed.) Citation

Zhu, Q., Yuan, J., Wang, G., & Hou, Y. (2025). Scheduling a Single-Arm Two-Cluster Tool With a Process Module Failure Subject to Wafer Residency Time Constraints. IEEE transactions on automation science and engineering, 22, 667-679. https://doi.org/10.1109/TASE.2023.3275703

Chicago Style (17th ed.) Citation

Zhu, Qinghua, Jun Yuan, Genghong Wang, and Yan Hou. "Scheduling a Single-Arm Two-Cluster Tool With a Process Module Failure Subject to Wafer Residency Time Constraints." IEEE Transactions on Automation Science and Engineering 22 (2025): 667-679. https://doi.org/10.1109/TASE.2023.3275703.

MLA (9th ed.) Citation

Zhu, Qinghua, et al. "Scheduling a Single-Arm Two-Cluster Tool With a Process Module Failure Subject to Wafer Residency Time Constraints." IEEE Transactions on Automation Science and Engineering, vol. 22, 2025, pp. 667-679, https://doi.org/10.1109/TASE.2023.3275703.