Advances in mechanism and application of diffusion bonding of titanium alloys

• Published in: Journal of materials processing technology Vol. 337; p. 118736
• Main Authors: Li, Tianle, Lei, Yiwen, Chen, Lezong, Ye, Heng, Liu, Xiaochun, Li, Xifeng
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.03.2025
• Subjects: Diffusion bonding; Engineering application; Interface; Mechanical properties; Microstructure evolution; Titanium alloys; SAED; Al; EBSD; Titanium alloys; Cu; EDS; Ti; MD; OM; Fe; BCC; BOR; HEA; FCC; Mechanical properties; FCG; Diffusion bonding; STEM; α; β; HCP; PF; SEM; Mg; Engineering application; TEM; DB; IPF; Interface; Microstructure evolution; HAADF

Diffusion bonding (DB) has emerged as a prevalent and versatile materials processing technique for titanium (Ti) alloy parts and composites, producing high-quality joints and supporting continuous manufacturing. The diffusion bonding procedure has gained significant attention in producing complex co...