Advances in mechanism and application of diffusion bonding of titanium alloys - Li, Tianle; Lei, Yiwen; Chen, Lezong; Ye, Heng; Liu, Xiaochun; Li, Xifeng (Journal of materials processing technology, 2025)
Keywords: Diffusion bonding; Engineering application; Interface; Mechanical properties; Microstructure evolution; Titanium alloys; SAED; Al; EBSD; Titanium alloys; Cu; EDS; Ti; MD; OM; Fe; BCC; BOR; HEA; FCC; Mechanical properties; FCG; Diffusion bonding; STEM; α; β; HCP; PF; SEM; Mg; Engineering application; TEM; DB; IPF; Interface; Microstructure evolution; HAADF