A physics-based electromigration model for advanced interconnects - Chen, Wangyong; Yin, Binyu; Cai, Linlin; Wan, Yi (Microelectronics and reliability, 2025)
Keywords: Electromigration; Interconnect; Physics-based model; Time-to-failure; Electromigration; Interconnect; Physics-based model; Time-to-failure