Conductivities and curing properties of electron-beam-irradiated anisotropic conductive films
Radiation-curable acrylated epoxy oligomer was irradiated by using an electron beam (E-beam) with dosages of 5, 10, 20, 40, 80, 200, 400, and 550 kGy to investigate the electrical and the physical properties of anisotropic conductive films (ACFs) and to evaluate the potential application of radiatio...
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Published in | Journal of the Korean Physical Society Vol. 61; no. 2; pp. 282 - 285 |
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Format | Journal Article |
Language | English |
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Seoul
The Korean Physical Society
01.07.2012
한국물리학회 |
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Abstract | Radiation-curable acrylated epoxy oligomer was irradiated by using an electron beam (E-beam) with dosages of 5, 10, 20, 40, 80, 200, 400, and 550 kGy to investigate the electrical and the physical properties of anisotropic conductive films (ACFs) and to evaluate the potential application of radiation technology to flip-chip package processing. An ACF is an insulating epoxy matrix containing conducting particles that keep the electrical conductivity along the out-of-plane direction and the insulation property along the in-plane direction. The contact resistance between ACF joints cured by using an E-beam irradiation of 80 kGy was measured under a constant bonding pressure of 2 kgf/cm
2
to demonstrate the effects of pad pitch size and the number of added conductive particles in the epoxy resin. Three types of PCBs, 1000-, 500-, and 100-µm pad pitches, were employed while the E-beam curable epoxy resin was mixed with conductive particles in a weight ratio of 10:1. The measured average contact resistance was 0.24 Ω with a minimum of 0.06 Ω for the samples prepared with a 100-µm pad pitch size, which is compatible with or lower than the values obtained from thermally-cured commercial ACFs. Our results demonstrate that an E-beam is an effective radiation method for curing epoxy resins at low temperatures in a short time and can be employed as a new technique for bonding circuits in high-density electric devices. |
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AbstractList | Radiation-curable acrylated epoxy oligomer was irradiated by using an electron beam (E-beam) with dosages of 5, 10, 20, 40, 80, 200, 400, and 550 kGy to investigate the electrical and the physical properties of anisotropic conductive films (ACFs) and to evaluate the potential application of radiation technology to flip-chip package processing. An ACF is an insulating epoxy matrix containing conducting particles that keep the electrical conductivity along the out-of-plane direction and the insulation property along the in-plane direction. The contact resistance between ACF joints cured by using an E-beam irradiation of 80 kGy was measured under a constant bonding pressure of 2 kgf/cm
2
to demonstrate the effects of pad pitch size and the number of added conductive particles in the epoxy resin. Three types of PCBs, 1000-, 500-, and 100-µm pad pitches, were employed while the E-beam curable epoxy resin was mixed with conductive particles in a weight ratio of 10:1. The measured average contact resistance was 0.24 Ω with a minimum of 0.06 Ω for the samples prepared with a 100-µm pad pitch size, which is compatible with or lower than the values obtained from thermally-cured commercial ACFs. Our results demonstrate that an E-beam is an effective radiation method for curing epoxy resins at low temperatures in a short time and can be employed as a new technique for bonding circuits in high-density electric devices. Radiation-curable acrylated epoxy oligomer was irradiated by using an electron beam (E-beam) with dosages of 5, 10, 20, 40, 80, 200, 400, and 550 kGy to investigate the electrical and the physical properties of anisotropic conductive films (ACFs) and to evaluate the potential application of radiation technology to flip-chip package processing. An ACF is an insulating epoxy matrix containing conducting particles that keep the electrical conductivity along the out-of-plane direction and the insulation property along the in-plane direction. The contact resistance between ACF joints cured by using an E-beam irradiation of 80 kGy was measured under a constant bonding pressure of 2 kgf/cm2 to demonstrate the effects of pad pitch size and the number of added conductive particles in the epoxy resin. Three types of PCBs, 1000-, 500-, and 100-탆 pad pitches, were employed while the E-beam curable epoxy resin was mixed with conductive particles in a weight ratio of 10:1. The measured average contact resistance was 0.24 ?with a minimum of 0.06 ?for the samples prepared with a 100-? pad pitch size, which is compatible with or lower than the values obtained from thermally-cured commercial ACFs. Our results demonstrate that an E-beam is an effective radiation method for curing epoxy resins at low temperatures in a short time and can be employed as a new technique for bonding circuits in high-density electric devices. KCI Citation Count: 0 |
Author | Kim, Jae yong Shin, Tae Gyu Lee, Inhyuk |
Author_xml | – sequence: 1 givenname: Tae Gyu surname: Shin fullname: Shin, Tae Gyu organization: Neutron Science Division, Korea Atomic Energy Research Institute – sequence: 2 givenname: Inhyuk surname: Lee fullname: Lee, Inhyuk organization: Department of Physics, Hanyang University – sequence: 3 givenname: Jae yong surname: Kim fullname: Kim, Jae yong email: kimjy@hanyang.ac.kr organization: Department of Physics, Hanyang University |
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Cites_doi | 10.1016/j.radphyschem.2007.02.021 10.1016/j.radphyschem.2007.11.006 10.5012/jkcs.2003.47.3.250 10.3365/met.mat.2008.06.373 10.1007/s11664-006-0194-x 10.1016/j.compositesa.2008.12.010 10.1109/95.705468 10.1016/0969-806X(95)00424-V 10.1109/6040.763188 10.1016/S1359-835X(97)00076-6 10.1016/S0032-3861(01)00450-5 10.1016/S0026-2714(03)00185-9 |
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Title | Conductivities and curing properties of electron-beam-irradiated anisotropic conductive films |
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