APA (7th ed.) Citation

Araki, N., Eto, M., Azuma, S., Klengel, R., Klengel, S., & Yamada, T. (2025). Understanding improved pitting corrosion resistance under high temperature application leading to a newly developed palladium coated copper wire. Microelectronics and reliability, 168, 115696. https://doi.org/10.1016/j.microrel.2025.115696

Chicago Style (17th ed.) Citation

Araki, Noritoshi, Motoki Eto, Shinya Azuma, Robert Klengel, Sandy Klengel, and Takashi Yamada. "Understanding Improved Pitting Corrosion Resistance Under High Temperature Application Leading to a Newly Developed Palladium Coated Copper Wire." Microelectronics and Reliability 168 (2025): 115696. https://doi.org/10.1016/j.microrel.2025.115696.

MLA (9th ed.) Citation

Araki, Noritoshi, et al. "Understanding Improved Pitting Corrosion Resistance Under High Temperature Application Leading to a Newly Developed Palladium Coated Copper Wire." Microelectronics and Reliability, vol. 168, 2025, p. 115696, https://doi.org/10.1016/j.microrel.2025.115696.