Zhang, L., Wang, S., Chen, X., Guo, J., Xu, L., Ling, S., & Zhang, X. (2025). Failure analysis and reliability assessment of gold-plated fuzz buttons in elevated temperature. Microelectronics and reliability, 168, 115687. https://doi.org/10.1016/j.microrel.2025.115687
Chicago Style (17th ed.) CitationZhang, L., S. Wang, X. Chen, J. Guo, L. Xu, S. Ling, and X. Zhang. "Failure Analysis and Reliability Assessment of Gold-plated Fuzz Buttons in Elevated Temperature." Microelectronics and Reliability 168 (2025): 115687. https://doi.org/10.1016/j.microrel.2025.115687.
MLA (9th ed.) CitationZhang, L., et al. "Failure Analysis and Reliability Assessment of Gold-plated Fuzz Buttons in Elevated Temperature." Microelectronics and Reliability, vol. 168, 2025, p. 115687, https://doi.org/10.1016/j.microrel.2025.115687.