Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits

• Published in: Journal of applied physics Vol. 118; no. 13
• Main Authors: Liu, Yingxia, Li, Menglu, Kim, Dong Wook, Gu, Sam, Tu, K. N.
• Format: Journal Article
• Language: English
• Published: Melville American Institute of Physics 07.10.2015
• Subjects: Addition polymerization; Applied physics; Electromigration; Failure modes; Flip chip soldering; Integrated circuits; Magnetic fields; Ohmic dissipation; Positive feedback; Resistance heating; Semiconductor devices; Silicon substrates; Soldered joints; Synergistic effect; Time dependence

In system level electromigration test of 2.5D integrated circuits, a failure mode due to synergistic effect of Joule heating and electromigration has been found. In the test circuit, there are three levels of solder joints, two Si chips (one of them has through-Si-via), and one polymer substrate. In...