Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits - Liu, Yingxia; Li, Menglu; Kim, Dong Wook; Gu, Sam; Tu, K. N. (Journal of applied physics, 2015)
Keywords: Addition polymerization; Applied physics; Electromigration; Failure modes; Flip chip soldering; Integrated circuits; Magnetic fields; Ohmic dissipation; Positive feedback; Resistance heating; Semiconductor devices; Silicon substrates; Soldered joints; Synergistic effect; Time dependence