APA (7th ed.) Citation

Liu, Y., Li, M., Kim, D. W., Gu, S., & Tu, K. N. (2015). Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits. Journal of applied physics, 118(13), . https://doi.org/10.1063/1.4932598

Chicago Style (17th ed.) Citation

Liu, Yingxia, Menglu Li, Dong Wook Kim, Sam Gu, and K. N. Tu. "Synergistic Effect of Electromigration and Joule Heating on System Level Weak-link Failure in 2.5D Integrated Circuits." Journal of Applied Physics 118, no. 13 (2015). https://doi.org/10.1063/1.4932598.

MLA (9th ed.) Citation

Liu, Yingxia, et al. "Synergistic Effect of Electromigration and Joule Heating on System Level Weak-link Failure in 2.5D Integrated Circuits." Journal of Applied Physics, vol. 118, no. 13, 2015, https://doi.org/10.1063/1.4932598.