The decomposition behavior of Ti2SnC synergistically enhances the mechanical properties of graphene copper matrix composites

• Published in: Journal of alloys and compounds Vol. 1010; p. 178263
• Main Authors: Xiao, Jun, Li, Xiao-Qiang, Jiang, Qi, Qu, Sheng-Guan, Yang, Chao
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 05.01.2025
• Subjects: Chemical vapor deposition (CVD); Gr @ Cu / Ti2SnC composites; Interface decoration; Mechanical properties; Mechanical properties; Chemical vapor deposition (CVD); Gr @ Cu / Ti2SnC composites; Interface decoration
• DOI: 10.1016/j.jallcom.2024.178263
• ISSN: 0925-8388

In composites, the enhancement of composite properties by a single reinforcer is always limited, while the construction of multi-component composites by synthesizing the characteristics between the components can achieve another breakthrough in composite properties. In this work, Gr @ Cu/Ti2SnC composites were prepared by chemical vapor deposition and powder metallurgy processes, and the structural design of graphene copper-based composites and the in-situ decomposition properties of Ti2SnC were combined to achieve a balanced development of composite strength-plastic toughness. The microstructure and mechanical properties of Gr @ Cu/Ti2SnC composites with different Ti2SnC contents were systematically investigated. The results show that after densification by SPS sintering, the TiC phase left by the in-situ decomposition of Ti2SnC becomes an intermediate layer between graphene and Cu matrix, which improves the interfacial bonding between graphene and Cu matrix, and at the same time, the layered graphene can alleviate the distortion field generated by the in-situ decomposition of Ti2SnC and promote the deflection of cracks, which improves the plasticity and toughness of the composites to a certain extent. With Ti2SnC content of 9 wt%, the yield strength and tensile strength reached 308 MPa and 490 MPa, respectively, which were 155 % and 108 % higher than that of pure copper, and the elongation could still be maintained above 20 %. •The interface bonding between graphene and Cu was modified by the decomposition product of Ti2SnC.•Graphene with layered structure distribution was successfully constructed by chemical vapor deposition.•The introduction of graphene effectively reduces the dislocation density of the composite material.•The strengthening mechanism and interface effectiveness of composite materials were analyzed from multiple perspectives.