Progress in insulated gate bipolar transistor thermal management: From fundamentals to advanced strategies

Renewable energy and electric vehicles are crucial subjects of the global transition towards a sustainable future. Insulated gate bipolar transistors (IGBTs) are essential components of these systems, generating substantial heat during operation. This review provides a comprehensive overview of the...

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Published inRenewable & sustainable energy reviews Vol. 210; p. 115219
Main Authors Rehman, Tauseef-ur, Park, Cheol Woo
Format Journal Article
LanguageEnglish
Published Elsevier Ltd 01.03.2025
Subjects
IGBT
Junction temperature
Temperature uniformity
Thermal management
Thermal reliability
Thermal resistance
Temperature uniformity
Thermal management
IGBT
Thermal reliability
Thermal resistance
Junction temperature
Online AccessGet full text
ISSN1364-0321
DOI10.1016/j.rser.2024.115219

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Abstract Renewable energy and electric vehicles are crucial subjects of the global transition towards a sustainable future. Insulated gate bipolar transistors (IGBTs) are essential components of these systems, generating substantial heat during operation. This review provides a comprehensive overview of the thermal control strategies for IGBTs, covering fundamental concepts, heat generation mechanisms, thermal failure modes and state-of-the-art cooling techniques. The review emphasises the reduction of junction temperature, thermal resistance and temperature gradient in IGBT chips and modules. Various cooling technologies are explored, including air and liquid cooling with novel configurations, PCM-based cooling, two-phase cooling (microchannels, thermosyphon and vapour chambers), nanofluid-based cooling, spray and jet impingement and hybrid configurations. This review highlights the significance of flow rate, fluid type, cooling system configuration and flow type (single or two-phase) on cooling performance. Key findings from extensive research are summarised, including the inadequacy of natural air circulation for thermal buffering, the effectiveness of passive cooling techniques for low to moderate heat generation, effectiveness of two-phase cooling for elevated heat flux and the directions for making the cooling systems hybrid (active and passive). This review sums up by discussing the outlook, challenges and future directions in IGBT thermal management, emphasising the need for further investigation into the diverse areas of thermal management leading towards the implications of the research at commercial level. •Natural air cooling is inadequate for IGBTs; forced convection is crucial.•Passive cooling is suitable for low-to-moderate heat generating IGBTs.•Vapour chambers reveal superior performance amongst passive cooling systems.•Passive–air hybrid cooling system benefits high-power IGBTs with space constraints.•Two-phase microchannel heat sinks outperform air cooling.
AbstractList Renewable energy and electric vehicles are crucial subjects of the global transition towards a sustainable future. Insulated gate bipolar transistors (IGBTs) are essential components of these systems, generating substantial heat during operation. This review provides a comprehensive overview of the thermal control strategies for IGBTs, covering fundamental concepts, heat generation mechanisms, thermal failure modes and state-of-the-art cooling techniques. The review emphasises the reduction of junction temperature, thermal resistance and temperature gradient in IGBT chips and modules. Various cooling technologies are explored, including air and liquid cooling with novel configurations, PCM-based cooling, two-phase cooling (microchannels, thermosyphon and vapour chambers), nanofluid-based cooling, spray and jet impingement and hybrid configurations. This review highlights the significance of flow rate, fluid type, cooling system configuration and flow type (single or two-phase) on cooling performance. Key findings from extensive research are summarised, including the inadequacy of natural air circulation for thermal buffering, the effectiveness of passive cooling techniques for low to moderate heat generation, effectiveness of two-phase cooling for elevated heat flux and the directions for making the cooling systems hybrid (active and passive). This review sums up by discussing the outlook, challenges and future directions in IGBT thermal management, emphasising the need for further investigation into the diverse areas of thermal management leading towards the implications of the research at commercial level. •Natural air cooling is inadequate for IGBTs; forced convection is crucial.•Passive cooling is suitable for low-to-moderate heat generating IGBTs.•Vapour chambers reveal superior performance amongst passive cooling systems.•Passive–air hybrid cooling system benefits high-power IGBTs with space constraints.•Two-phase microchannel heat sinks outperform air cooling.
ArticleNumber 115219
Author Park, Cheol Woo
Rehman, Tauseef-ur
Author_xml – sequence: 1
  givenname: Tauseef-ur
  orcidid: 0000-0001-9633-6331
  surname: Rehman
  fullname: Rehman, Tauseef-ur
– sequence: 2
  givenname: Cheol Woo
  orcidid: 0000-0002-3650-1558
  surname: Park
  fullname: Park, Cheol Woo
  email: chwoopark@knu.ac.kr
BookMark eNp9kE1LAzEQhnOoYFv9A57yB7Zmsp8VL1KsCgU96Dlkk9k1y25SkrTgvzdLPQvDfPDyDDPviiyss0jIHbANMKjuh40P6Dec8WIDUHLYLsgS8qrIWM7hmqxCGBiDsqnzJRk-vOs9hkCNTRFOo4yoaZ8ybc3RjdLT6KUNJkSX2m_0kxzpJK3scUIbH-jeu4l2J6vlPMsx0Oio1GdpVdoUEh2xNxhuyFWXVLz9q2vytX_-3L1mh_eXt93TIVO8hJi1lcxVJVnZFJhDVdW8ACwlgm7zWkKrAFF3TcO05m3Lts0sqaYouy10TY35mvDLXuVdCB47cfRmkv5HABOzQ2IQs0NidkhcHErQ4wXCdNnZJDUog_MHxqOKQjvzH_4LjCd2mQ
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ContentType Journal Article
Copyright 2024 Elsevier Ltd
Copyright_xml – notice: 2024 Elsevier Ltd
DBID AAYXX
CITATION
DOI 10.1016/j.rser.2024.115219
DatabaseName CrossRef
DatabaseTitle CrossRef
DatabaseTitleList
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
ExternalDocumentID 10_1016_j_rser_2024_115219
S1364032124009456
GroupedDBID --K
--M
.~1
0R~
123
1B1
1RT
1~.
1~5
29P
4.4
457
4G.
5VS
7-5
71M
8P~
AABNK
AACTN
AAEDT
AAEDW
AAHCO
AAIKJ
AAKOC
AALRI
AAOAW
AAQFI
AAQXK
AARJD
AAXKI
AAXUO
ABFNM
ABJNI
ABMAC
ABWVN
ABXDB
ACDAQ
ACGFS
ACRLP
ACRPL
ADBBV
ADEZE
ADHUB
ADMUD
ADNMO
AEBSH
AEIPS
AEKER
AENEX
AFJKZ
AFKWA
AFTJW
AGHFR
AGUBO
AGYEJ
AHIDL
AIEXJ
AIKHN
AITUG
AJOXV
AKRWK
ALMA_UNASSIGNED_HOLDINGS
AMFUW
AMRAJ
ASPBG
AVWKF
AXJTR
AZFZN
BELTK
BKOJK
BLXMC
CS3
DU5
EBS
EFJIC
EJD
EO8
EO9
EP2
EP3
FDB
FEDTE
FGOYB
FIRID
FNPLU
FYGXN
G-Q
GBLVA
HVGLF
HZ~
IHE
J1W
JARJE
KOM
M41
MO0
N9A
O-L
O9-
OAUVE
OZT
P-8
P-9
P2P
PC.
Q38
R2-
RIG
ROL
RPZ
SDF
SDG
SDP
SES
SEW
SPC
SPCBC
SSR
SSZ
T5K
Y6R
ZCA
~G-
AATTM
AAYWO
AAYXX
ACVFH
ADCNI
AEUPX
AFPUW
AFXIZ
AGCQF
AGQPQ
AGRNS
AIGII
AIIUN
AKBMS
AKYEP
ANKPU
APXCP
BNPGV
CITATION
SSH
ID FETCH-LOGICAL-c251t-b6a3c6a0584e31667241e5ae1db37a1bc1eedf880dd2bb098ae1dc845f91f87e3
IEDL.DBID .~1
ISSN 1364-0321
IngestDate Tue Jul 01 03:18:35 EDT 2025
Sat Feb 01 16:09:15 EST 2025
IsPeerReviewed true
IsScholarly true
Keywords Temperature uniformity
Thermal management
IGBT
Thermal reliability
Thermal resistance
Junction temperature
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c251t-b6a3c6a0584e31667241e5ae1db37a1bc1eedf880dd2bb098ae1dc845f91f87e3
ORCID 0000-0002-3650-1558
0000-0001-9633-6331
ParticipantIDs crossref_primary_10_1016_j_rser_2024_115219
elsevier_sciencedirect_doi_10_1016_j_rser_2024_115219
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate March 2025
2025-03-00
PublicationDateYYYYMMDD 2025-03-01
PublicationDate_xml – month: 03
  year: 2025
  text: March 2025
PublicationDecade 2020
PublicationTitle Renewable & sustainable energy reviews
PublicationYear 2025
Publisher Elsevier Ltd
Publisher_xml – name: Elsevier Ltd
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SSID ssj0015873
Score 2.4763584
SecondaryResourceType review_article
Snippet Renewable energy and electric vehicles are crucial subjects of the global transition towards a sustainable future. Insulated gate bipolar transistors (IGBTs)...
SourceID crossref
elsevier
SourceType Index Database
Publisher
StartPage 115219
SubjectTerms IGBT
Junction temperature
Temperature uniformity
Thermal management
Thermal reliability
Thermal resistance
Title Progress in insulated gate bipolar transistor thermal management: From fundamentals to advanced strategies
URI https://dx.doi.org/10.1016/j.rser.2024.115219
Volume 210
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LS8NAEF5KvehBfGJ9lD14k9hsdrNJvJViqa9S1EJvIfsIpNC0tPHqb3cmj6IgHjwFkt0QZifffJN8M0vItUrAEQRjTqC0ckTAI0ehLxvraStlFGqNieLLWI6m4nHmz1pk0NTCoKyyxv4K00u0rs_0amv2VlnWe2NcCpcD9AqUx_nYdluIAL389nMr82B-WP5lxsEOjq4LZyqN1xqWGXJETwByQByLfg9O3wLO8IDs10yR9quHOSQtmx-RvW_9A4_JfILqKsAqmuW0VJUDczQUv4xRla0wa6UFBqOyFwhFrreAWy62kpc7OlwvFzTFcpCqy_-GFkvaCAPopmg6SZyQ6fD-fTBy6s0THA2UpXCUTLiWiQsEw3ImZQCh2vqJZUbxIGFKM4iOKby9xnhKuVGIl3Qo_DRiaRhYfkra-TK3Z4SyyNcGUg_hhqnwjRem2kQ6kkqlgfUM75CbxmrxquqRETfisXmMNo7RxnFl4w7xG8PGP1Y6BhD_Y975P-ddkF0P9-wtdWOXpF2sP-wVEIlCdUtP6ZKd_uD1eYLHh6fR-As7Vcwm
linkProvider Elsevier
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1LS8NAEB60HtSD-MT63IM3Ce0mu5vEWxFLqrYIKngL2UeghT5o4_93Jg-pIB68JpkQZme_mcl--y3Ajc4wEATnXqiN9kQYxJ6mWLbON06pODKGGsXhSCXv4vFDfmzAfbMXhmiVNfZXmF6idX2lU3uzsxiPO688UKIbIPQKosdJtQlbpE4lW7DVGzwlo-_FBBmVC830vEcG9d6Ziua1xJHGNtEXCB6YyuLf89Nazunvw15dLLJe9T0HsOFmh7C7JiF4BJMXIlghXLHxjJXEciweLaOfY0yPF9S4soLyUSkHwqjcm-Irp9-slzvWX86nLKcdIZXQ_4oVc9ZwA9iqaMQkjuG9__B2n3j1-Qmewaql8LTKAqOyLtYYLuBKhZitncwctzoIM64NxwSZ4wS21te6G0d0y0RC5jHPo9AFJ9CazWfuFBiPpbHYfYhulAtp_Sg3Njax0joPnW-DNtw2XksXlUxG2vDHJin5OCUfp5WP2yAbx6Y_BjtFHP_D7uyfdtewnbwNn9PnwejpHHZ8OsK3pJFdQKtYfrpLrCsKfVXHzRffOM1C
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Progress+in+insulated+gate+bipolar+transistor+thermal+management%3A+From+fundamentals+to+advanced+strategies&rft.jtitle=Renewable+%26+sustainable+energy+reviews&rft.au=Rehman%2C+Tauseef-ur&rft.au=Park%2C+Cheol+Woo&rft.date=2025-03-01&rft.pub=Elsevier+Ltd&rft.issn=1364-0321&rft.volume=210&rft_id=info:doi/10.1016%2Fj.rser.2024.115219&rft.externalDocID=S1364032124009456
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1364-0321&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1364-0321&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1364-0321&client=summon