Towards True In-situ Temperature Compensation Utilizing Multiple Parameter Decoupling for Resonant MEMS Sensors Subject to Blue Sideband Excitation

• Published in: IEEE sensors letters Vol. 8; no. 4; pp. 1 - 4
• Main Authors: Xi, Jingqian, Zheng, Zhuoyue, Liu, Huafeng, Zhang, Pan, Zhao, Chun, Wang, Yuan, Wang, Chen, Kraft, Michael, Martins, Rui P., Mak, Pui-In
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.04.2024; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: blue-sideband excitation (BSE); Decoupling; Excitation; Mechanical sensors; Microelectromechanical systems; Micromechanical devices; multiple parameter decoupling (MPD); Parameters; Resonant frequency; resonant sensor; Resonators; Sensitivity; Sensors; Sidebands; Temperature compensation; Temperature measurement; Temperature sensors; Thermometers; Thermometry
• ISSN: 2475-1472; 2475-1472
• DOI: 10.1109/LSENS.2024.3374377

This letter conducts a thorough comparison between two temperature compensation methods for resonant micro-electro-mechanical-system (MEMS) sensors, i.e., 1) a newly proposed in-situ temperature compensation technique based on a multiple parameter decoupling (MPD) using a single resonant MEMS sensor subject to blue-sideband excitation, and 2) the prevailing method utilizing a temperature sensor, which, in this letter, is a resonant thermometer in close vicinity of the sensor. Experimental results show that the MPD-based in-situ temperature compensation method offers better noise performance, long-term stability (fourfold at 1000s integration time) and application simplicity, compared with the compensation method using an additional thermometer, affirming that the proposed subject is of considerable potential for true in-situ temperature compensation for high-precision resonant MEMS sensors.