Three-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 14; no. 12; pp. 2248 - 2257
• Main Authors: Randriambololona, Andoniaina M., Manepalli, Vivek, McAfee, Rachel C., Ojha, Bidisha, Miraftab-Salo, Rahi, Guye, Kidus, Lee, Hyoungsoon, Graham, Samuel, Agonafer, Damena
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.12.2024; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Buffers; Composite materials; Conductivity; Copper; Electronics; Heat of fusion; Heating systems; Latent heat; Melting points; Metals; Phase change materials; Phase change materials (PCMs); Pulse duration; Temperature; Thermal conductivity; thermal energy storage; Thermal loading; Thermal management; transient thermal management

Harnessing phase change materials (PCMs) for thermal management of power electronic devices shows potential to improve their reliability while decreasing the size, weight, power, and cost (SWaP-C) of the system due to the PCM's high latent heat during solid-to-liquid transition. However, despit...