APA (7th ed.) Citation

Randriambololona, A. M., Manepalli, V., McAfee, R. C., Ojha, B., Miraftab-Salo, R., Guye, K., . . . Agonafer, D. (2024). Three-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads. IEEE transactions on components, packaging, and manufacturing technology (2011), 14(12), 2248-2257. https://doi.org/10.1109/TCPMT.2024.3376234

Chicago Style (17th ed.) Citation

Randriambololona, Andoniaina M., Vivek Manepalli, Rachel C. McAfee, Bidisha Ojha, Rahi Miraftab-Salo, Kidus Guye, Hyoungsoon Lee, Samuel Graham, and Damena Agonafer. "Three-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011) 14, no. 12 (2024): 2248-2257. https://doi.org/10.1109/TCPMT.2024.3376234.

MLA (9th ed.) Citation

Randriambololona, Andoniaina M., et al. "Three-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads." IEEE Transactions on Components, Packaging, and Manufacturing Technology (2011), vol. 14, no. 12, 2024, pp. 2248-2257, https://doi.org/10.1109/TCPMT.2024.3376234.