An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures

• Published in: International journal of impact engineering Vol. 175; p. 104542
• Main Authors: Long, Xu, Su, Tianxiong, Lu, Changheng, Wang, Shaobin, Huang, Jiaqiang, Chang, Chao
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.05.2023
• Subjects: Constitutive model; High strain rate; High temperature; Microstructure; VUMAT; Constitutive model; VUMAT; High temperature; Microstructure; High strain rate
• ISSN: 0734-743X; 1879-3509
• DOI: 10.1016/j.ijimpeng.2023.104542

•Dynamic properties of SAC305 lead-free solder are investigated under high strain rates and high temperatures.•Ultimate strength undergoes an initial ascending stage due to the refinement of β-Sn and eutectic phases as the applied strain rate increases.•With the further increase of strain rate, the...