Impact of Dielectrics in SOI FinFET for Lower Power Consumption in Punch-through Current-based Local Thermal Annealing - Cha, Dong-Woo; Park, Jun-Young (Journal of semiconductor technology and science, 2021)
Keywords: 전기공학; punch-through; Annealing; FinFET; reliability; hot-carrier injection (HCI); logic transistors; dielectric