Implementation of high thermal conductivity and synaptic metaplasticity in vertically-aligned hexagonal boron nitride-based memristor

• Published in: Science China materials Vol. 67; no. 6; pp. 1907 - 1914
• Main Authors: Zhang, Haizhong, Ju, Xin, Jiang, Haitao, Yang, Dan, Wei, Rongshan, Hu, Wei, Lu, Xiaoqiang, Zhu, Minmin
• Format: Journal Article
• Language: English
• Published: Beijing Science China Press 22.05.2024
• Subjects: Chemistry and Materials Science; Chemistry/Food Science; Materials Science; high thermal conductivity; vertically-aligned; boron nitride; low-power memory; neuromorphic computing

The next-generation computing system is required to perform 10 18 floating point operations per second to address the exponential growth of data from sensory terminals, driven by advancements in artificial intelligence and the Internet of Things. Even if a supercomputer possesses the capability to e...