In situ annealing studies on the microstructural evolution of a macro defect free electroformed nanocrystalline Ni-Co sheet metal and its relation to tensile properties
The effect of annealing at temperatures between 200 – 400 °C on the microstructural evolution and tensile properties of a recently developed macro defect free electroformed nanocrystalline Ni-32at%Co free-standing sheet metal was investigated. The tensile strength of the materials exhibited an extri...
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Published in | Acta materialia Vol. 246; p. 118711 |
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Main Authors | , , , , , , |
Format | Journal Article |
Language | English |
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Elsevier Ltd
01.03.2023
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Abstract | The effect of annealing at temperatures between 200 – 400 °C on the microstructural evolution and tensile properties of a recently developed macro defect free electroformed nanocrystalline Ni-32at%Co free-standing sheet metal was investigated. The tensile strength of the materials exhibited an extrinsic Hall-Petch (HP) to inverse Hall-Petch (IHP) transition due to grain growth. In situ transmission electron microscopy (TEM) annealing revealed for the first time that at lower annealing temperatures, in addition to reordering of atoms at grain boundaries, grain rotation and grain recovery were also found to be mechanisms for grain boundary relaxation (GBR). Combined, these mechanisms contribute to the increase in ultimate tensile strength (UTS) observed in the IHP regime of the Ni-32at%Co alloy. TEM energy dispersive X-ray spectroscopy (EDX) and in situ synchrotron X-ray diffraction (XRD) annealing analyses showed that the drop in UTS and ductility in the HP regime after annealing at higher temperatures was associated with the onset of abnormal grain growth and sulfur impurity segregation to random high angle boundaries. Atom probe tomography (APT) further showed that there is no sulfur impurity segregation in the electroformed material before annealing. Increasing in annealing temperature led therefore to a transition from ductile to brittle fracture manifested as a change in dimple to mixed and eventually to faceted brittle fracture surfaces at 400 °C.
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AbstractList | The effect of annealing at temperatures between 200 – 400 °C on the microstructural evolution and tensile properties of a recently developed macro defect free electroformed nanocrystalline Ni-32at%Co free-standing sheet metal was investigated. The tensile strength of the materials exhibited an extrinsic Hall-Petch (HP) to inverse Hall-Petch (IHP) transition due to grain growth. In situ transmission electron microscopy (TEM) annealing revealed for the first time that at lower annealing temperatures, in addition to reordering of atoms at grain boundaries, grain rotation and grain recovery were also found to be mechanisms for grain boundary relaxation (GBR). Combined, these mechanisms contribute to the increase in ultimate tensile strength (UTS) observed in the IHP regime of the Ni-32at%Co alloy. TEM energy dispersive X-ray spectroscopy (EDX) and in situ synchrotron X-ray diffraction (XRD) annealing analyses showed that the drop in UTS and ductility in the HP regime after annealing at higher temperatures was associated with the onset of abnormal grain growth and sulfur impurity segregation to random high angle boundaries. Atom probe tomography (APT) further showed that there is no sulfur impurity segregation in the electroformed material before annealing. Increasing in annealing temperature led therefore to a transition from ductile to brittle fracture manifested as a change in dimple to mixed and eventually to faceted brittle fracture surfaces at 400 °C.
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ArticleNumber | 118711 |
Author | Tam, Jason Erb, Uwe Kong, Jonathan Li, Terry J.H. McCrea, Jonathan L. Haché, Michel J.R. Howe, Jane Y. |
Author_xml | – sequence: 1 givenname: Jonathan orcidid: 0000-0002-3003-6114 surname: Kong fullname: Kong, Jonathan organization: Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, ON, M5S 3E4, Canada – sequence: 2 givenname: Terry J.H. surname: Li fullname: Li, Terry J.H. organization: Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, ON, M5S 3E4, Canada – sequence: 3 givenname: Michel J.R. orcidid: 0000-0002-5860-6799 surname: Haché fullname: Haché, Michel J.R. organization: Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, ON, M5S 3E4, Canada – sequence: 4 givenname: Jason orcidid: 0000-0002-9221-4609 surname: Tam fullname: Tam, Jason organization: Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, ON, M5S 3E4, Canada – sequence: 5 givenname: Jonathan L. surname: McCrea fullname: McCrea, Jonathan L. organization: Integran Technologies, Inc., 6300 Northam Drive, Mississauga, Ontario, L4V 1H7, Canada – sequence: 6 givenname: Jane Y. surname: Howe fullname: Howe, Jane Y. organization: Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, ON, M5S 3E4, Canada – sequence: 7 givenname: Uwe surname: Erb fullname: Erb, Uwe email: uwe.erb@utoronto.ca organization: Department of Materials Science and Engineering, University of Toronto, 184 College Street, Toronto, ON, M5S 3E4, Canada |
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Keywords | Tensile behaviour Structural relaxation Grain rotation Recovery Electrodeposited nanocrystalline material |
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SubjectTerms | Electrodeposited nanocrystalline material Grain rotation Recovery Structural relaxation Tensile behaviour |
Title | In situ annealing studies on the microstructural evolution of a macro defect free electroformed nanocrystalline Ni-Co sheet metal and its relation to tensile properties |
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