Effect of eco-friendly organic additives on copper electropolishing and process parameter optimization

• Published in: Surface engineering Vol. 40; no. 7-8; pp. 883 - 894
• Main Authors: Zhan, Q. F., Li, H. L., Wang, Y., Wang, Z. W.
• Format: Journal Article
• Language: English
• Published: London, England SAGE Publications 01.07.2024
• Subjects: copper; ascorbic acid; response surface methodology; electropolishing; glycerol

The type of organic additives significantly affects copper electropolishing performance, including glossiness and surface smoothness. Therefore, developing efficient and eco-friendly additives is crucial for advancing this technology. This study investigates the effects of glycerol and ascorbic acid...