Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging

• Published in: Microelectronics and reliability Vol. 138; p. 114688
• Main Authors: Liu, Canyu, Liu, Allan, Jiang, Han, Liang, Shuibao, Zhou, Zhaoxia, Liu, Changqing
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.11.2022
• Subjects: Cu clip bonding; Cu-15Ag-5P alloy; Self-propagating exothermic reaction; Cu clip bonding; Self-propagating exothermic reaction; Cu-15Ag-5P alloy

For the high-power modules packaging, Cu clip bonding has gained growing interest to replace the multiple wire-bonding for the benefits of lower resistance and improved thermal performance, which is especially beneficial for higher reliability. However, the current interconnection materials and bond...