Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
For the high-power modules packaging, Cu clip bonding has gained growing interest to replace the multiple wire-bonding for the benefits of lower resistance and improved thermal performance, which is especially beneficial for higher reliability. However, the current interconnection materials and bond...
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Published in | Microelectronics and reliability Vol. 138; p. 114688 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
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Elsevier Ltd
01.11.2022
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Abstract | For the high-power modules packaging, Cu clip bonding has gained growing interest to replace the multiple wire-bonding for the benefits of lower resistance and improved thermal performance, which is especially beneficial for higher reliability. However, the current interconnection materials and bonding processes cannot fully meet the reliability requirements of the emerging Cu clip integrated structure. Brazing alloys can serve in high-temperature conditions, since they have the melting points above 450 °C. However, very limited brazing alloys have been applied in electronics packaging since the processing temperature is also high if needs to be melted. It is promising to develop the low-temperature bonding technology which can serve at high temperatures. In this study, incorporating with the Cu-15Ag-5P brazing alloy as the interconnection material, the self-propagating exothermic reaction (SPER) has been applied to assist the Cu clip bonding process, which provides intense local heating to achieve the interconnects in millisecond scale. The bonding mechanism between Cu-15Ag-5P and Cu substrate is examined and discussed. The research findings promise an effective assembly route viable for the application of high-power electronics packaging.
•Cu clip bonding has been achieved by self-propagating exothermic reaction.•Cu-15Ag-5P alloy has been applied as high-temperature packaging material.•P in Cu-15Ag-5P acted as flux to break the Cu oxide layer during bonding. |
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AbstractList | For the high-power modules packaging, Cu clip bonding has gained growing interest to replace the multiple wire-bonding for the benefits of lower resistance and improved thermal performance, which is especially beneficial for higher reliability. However, the current interconnection materials and bonding processes cannot fully meet the reliability requirements of the emerging Cu clip integrated structure. Brazing alloys can serve in high-temperature conditions, since they have the melting points above 450 °C. However, very limited brazing alloys have been applied in electronics packaging since the processing temperature is also high if needs to be melted. It is promising to develop the low-temperature bonding technology which can serve at high temperatures. In this study, incorporating with the Cu-15Ag-5P brazing alloy as the interconnection material, the self-propagating exothermic reaction (SPER) has been applied to assist the Cu clip bonding process, which provides intense local heating to achieve the interconnects in millisecond scale. The bonding mechanism between Cu-15Ag-5P and Cu substrate is examined and discussed. The research findings promise an effective assembly route viable for the application of high-power electronics packaging.
•Cu clip bonding has been achieved by self-propagating exothermic reaction.•Cu-15Ag-5P alloy has been applied as high-temperature packaging material.•P in Cu-15Ag-5P acted as flux to break the Cu oxide layer during bonding. |
ArticleNumber | 114688 |
Author | Liang, Shuibao Liu, Changqing Liu, Canyu Jiang, Han Liu, Allan Zhou, Zhaoxia |
Author_xml | – sequence: 1 givenname: Canyu surname: Liu fullname: Liu, Canyu email: c.liu2@lboro.ac.uk organization: Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Leicestershire, UK – sequence: 2 givenname: Allan surname: Liu fullname: Liu, Allan organization: Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Leicestershire, UK – sequence: 3 givenname: Han surname: Jiang fullname: Jiang, Han organization: Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Leicestershire, UK – sequence: 4 givenname: Shuibao surname: Liang fullname: Liang, Shuibao organization: Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Leicestershire, UK – sequence: 5 givenname: Zhaoxia surname: Zhou fullname: Zhou, Zhaoxia organization: Loughborough Materials Characterization Center, Loughborough University, Leicestershire, UK – sequence: 6 givenname: Changqing surname: Liu fullname: Liu, Changqing email: c.liu@lboro.ac.uk organization: Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Leicestershire, UK |
BookMark | eNqFkM1OwzAQhC1UJNrCKyC_QILXSe30Bqr4kypxACRuluNsUpc0juxQ4O1xFDhz2ZVWM6Odb0FmneuQkEtgKTAQV_v0YI13HtuUM85TgFwUxQmZQyF5ss7hbUbmjHGRcAn5GVmEsGeMSQYwJ-0ztnXSe9frRg-2ayh-uWGHPmZSj9oM1nVUh2DDgBXdfFDT2p6WrqtGce08xbrGKDsi3dlml_TuE-OxjTfvOmsC7bV5102Un5PTWrcBL373krze3b5sHpLt0_3j5mabGJ7JIdGizLEsJctLrY0Q0kCxRlmwbJUxKGpEvpKgcyNArHWOOtYScgXcZNNcEjHlRiwheKxV7-1B-28FTI3M1F79MVMjMzUxi8bryYjxu6NFr4Kx2BmsrI99VOXsfxE_iVR8zQ |
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ContentType | Journal Article |
Copyright | 2022 |
Copyright_xml | – notice: 2022 |
DBID | 6I. AAFTH AAYXX CITATION |
DOI | 10.1016/j.microrel.2022.114688 |
DatabaseName | ScienceDirect Open Access Titles Elsevier:ScienceDirect:Open Access CrossRef |
DatabaseTitle | CrossRef |
DatabaseTitleList | |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1872-941X |
ExternalDocumentID | 10_1016_j_microrel_2022_114688 S0026271422002128 |
GroupedDBID | --K --M .DC .~1 0R~ 123 1B1 1~. 1~5 29M 4.4 457 4G. 5VS 6I. 7-5 71M 8P~ 9JN AABNK AABXZ AACTN AAEDT AAEDW AAEPC AAFTH AAIAV AAIKJ AAKOC AALRI AAOAW AAQFI AAQXK AAXUO AAYFN ABBOA ABFNM ABFRF ABJNI ABMAC ABXDB ABXRA ABYKQ ACDAQ ACGFS ACNNM ACRLP ACZNC ADBBV ADEZE ADJOM ADMUD ADTZH AEBSH AECPX AEFWE AEKER AENEX AEZYN AFKWA AFRZQ AFTJW AGHFR AGUBO AGYEJ AHHHB AHJVU AHZHX AIALX AIEXJ AIKHN AITUG AJBFU AJOXV ALMA_UNASSIGNED_HOLDINGS AMFUW AMRAJ AOUOD AXJTR AZFZN BJAXD BKOJK BLXMC CS3 DU5 EBS EFJIC EFLBG EJD EO8 EO9 EP2 EP3 F5P FDB FEDTE FGOYB FIRID FNPLU FYGXN G-2 G-Q GBLVA GBOLZ HVGLF HZ~ IHE J1W JJJVA KOM LY7 M41 MAGPM MO0 N9A O-L O9- OAUVE OZT P-8 P-9 P2P PC. Q38 R2- RIG RNS ROL RPZ RXW SDF SDG SES SET SEW SPC SPCBC SPD SSM SST SSV SSZ T5K T9H TAE UHS UNMZH WUQ XOL ZMT ~G- AAXKI AAYXX ACRPL ADNMO AFJKZ AKRWK CITATION |
ID | FETCH-LOGICAL-c237t-a6b4ebb704baac667c189e780353018fee2571a4c6169a4ea71467512c37512c3 |
IEDL.DBID | AIKHN |
ISSN | 0026-2714 |
IngestDate | Fri Dec 06 07:33:13 EST 2024 Fri Feb 23 02:41:55 EST 2024 |
IsDoiOpenAccess | true |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Keywords | Cu clip bonding Self-propagating exothermic reaction Cu-15Ag-5P alloy |
Language | English |
License | This is an open access article under the CC BY license. |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c237t-a6b4ebb704baac667c189e780353018fee2571a4c6169a4ea71467512c37512c3 |
OpenAccessLink | https://www.sciencedirect.com/science/article/pii/S0026271422002128 |
ParticipantIDs | crossref_primary_10_1016_j_microrel_2022_114688 elsevier_sciencedirect_doi_10_1016_j_microrel_2022_114688 |
PublicationCentury | 2000 |
PublicationDate | November 2022 2022-11-00 |
PublicationDateYYYYMMDD | 2022-11-01 |
PublicationDate_xml | – month: 11 year: 2022 text: November 2022 |
PublicationDecade | 2020 |
PublicationTitle | Microelectronics and reliability |
PublicationYear | 2022 |
Publisher | Elsevier Ltd |
Publisher_xml | – name: Elsevier Ltd |
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SSID | ssj0007011 |
Score | 2.4087276 |
Snippet | For the high-power modules packaging, Cu clip bonding has gained growing interest to replace the multiple wire-bonding for the benefits of lower resistance and... |
SourceID | crossref elsevier |
SourceType | Aggregation Database Publisher |
StartPage | 114688 |
SubjectTerms | Cu clip bonding Cu-15Ag-5P alloy Self-propagating exothermic reaction |
Title | Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging |
URI | https://dx.doi.org/10.1016/j.microrel.2022.114688 |
Volume | 138 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV3NS8MwFH_s46IH8RPnx8jBa7Y2zZL2OIZjKu6ig91KkmWwObcyN_Dk3-5L2uoEwYOXQguh5aXv935J3u89gJsgkokyYUw1Lg4ot2FCtdCCGhlIpnnC7dTtdzwOxWDE78edcQV6pRbGpVUW2J9jukfr4km7sGY7m82cxpcJJt0ehq9THlehjuHIndXWu3cPg-EXIMsgzBvnMUHdgB2h8Lz16vLe1tadQjDmK-f6Jiy_xKiduNM_hIOCMJJu_k1HULHLY9jfKSN4Aosnu5hShEIEB-XSmIl998IqfCtBUuilCwRZspvSCeltiVnMMqJXXtFCkLaSPK0DkY-4-sU0c73TyHeLnDeCS-sX39DoFEb92-fegBZdFKhhkdxQJTS3WsuAa6WMEBJnJrEyDqIOOnc8tRa9NlTciFAkilslHXgiDzBRfj2D2nK1tOdAJAvMFBnXxJiII5VRVgYJ0xOr0K2l0Q1ol3ZLs7xYRlpmkc3T0tKps3SaW7oBSWne9Me0p4jof4y9-MfYS9hzd7mo8Apqm_XWXiO72OgmVFsfYbP4hz4BfaHQqg |
link.rule.ids | 314,780,784,4502,24116,27924,27925,45585,45679 |
linkProvider | Elsevier |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwpV3PT8IwFG4QD-rB-DPizx68FrautNvREAkqcBESbk1bugREWBAST_7tvnZbwMTEg5cdtjVb3mu_fm3f9x5C90EkEmXCmGhYHBBmw4RorjkxIhBUs4TZ1O139Pq8M2TPo-aoglqlFsaFVRbYn2O6R-viTqOwZiObTJzGl3Iq3B6Gz1Me76Bd1gT2C526_rWJ8xBBmJfNo5y417dkwtP6u4t6W1p3BkGpz5vrS7D8MkNtzTrtI3RY0EX8kP_RMarY-Qk62EoieIpmr3aWEgBCgAblgpix_fSyKvgqBkrohQsYOLJz6Bi31tjMJhnWC69nwUBacR7UAbiHXfZikrnKaXhTIOcDw8L6zZczOkPD9uOg1SFFDQViaCRWRHHNrNYiYFopw7kAvyRWxEHUhKEdp9bCmA0VMzzkiWJWCQedwAJMlF_PUXW-mNsLhAUNTAp8a2xMxIDIKCuChOqxVTCohdE11CjtJrM8VYYsY8imsrS0dJaWuaVrKCnNK384XQKe_9H28h9t79BeZ9Dryu5T_-UK7bsnubzwGlVXy7W9AZ6x0re-H30DYafRgw |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Self-propagating+exothermic+reaction+assisted+Cu+clip+bonding+for+effective+high-power+electronics+packaging&rft.jtitle=Microelectronics+and+reliability&rft.au=Liu%2C+Canyu&rft.au=Liu%2C+Allan&rft.au=Jiang%2C+Han&rft.au=Liang%2C+Shuibao&rft.date=2022-11-01&rft.pub=Elsevier+Ltd&rft.issn=0026-2714&rft.eissn=1872-941X&rft.volume=138&rft_id=info:doi/10.1016%2Fj.microrel.2022.114688&rft.externalDocID=S0026271422002128 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0026-2714&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0026-2714&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0026-2714&client=summon |