APA (7th ed.) Citation

So, J., Yoon, Y., & Yoon, S. (2025). Thermal Analysis of Indirect Double-sided Cooling Power Modules Considering the Impact of ThermalInterface Material Characteristics. Journal of semiconductor technology and science, 25(2), 148-153. https://doi.org/10.5573/JSTS.2025.25.2.148

Chicago Style (17th ed.) Citation

So, Ji-Yong, Young-Doo Yoon, and SangWon Yoon. "Thermal Analysis of Indirect Double-sided Cooling Power Modules Considering the Impact of ThermalInterface Material Characteristics." Journal of Semiconductor Technology and Science 25, no. 2 (2025): 148-153. https://doi.org/10.5573/JSTS.2025.25.2.148.

MLA (9th ed.) Citation

So, Ji-Yong, et al. "Thermal Analysis of Indirect Double-sided Cooling Power Modules Considering the Impact of ThermalInterface Material Characteristics." Journal of Semiconductor Technology and Science, vol. 25, no. 2, 2025, pp. 148-153, https://doi.org/10.5573/JSTS.2025.25.2.148.