A Comprehensive Investigation of Thermal Risks in Wireless EV Chargers Considering Spatial Misalignment From a Dynamic Perspective
As wireless electric vehicle charging (WEVC) technology moves toward commercialization, understanding its associated risks is crucial, particularly with the trend toward high-power fast charging. In this article, thermal risks and factors exacerbating the risks in wireless electric vehicle chargers...
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Published in | IEEE journal of emerging and selected topics in industrial electronics (Print) Vol. 5; no. 4; pp. 1560 - 1571 |
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Main Authors | , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.10.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
ISSN | 2687-9735 2687-9743 |
DOI | 10.1109/JESTIE.2024.3417244 |
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Abstract | As wireless electric vehicle charging (WEVC) technology moves toward commercialization, understanding its associated risks is crucial, particularly with the trend toward high-power fast charging. In this article, thermal risks and factors exacerbating the risks in wireless electric vehicle chargers are investigated comprehensively, focusing on the magnetic coupler and foreign objects (FOs) intruding on the charging area. The power losses and temperatures of the coupler and FOs are obtained using a two-way electromagnetic-thermal coupled model, and the coupler will be assigned to a risk level according to the proposed four-temperature-level risk evaluation mechanism. In this model, practical considerations include coil types, misalignments, FO materials, ambient temperatures, etc. Moreover, a dynamic perspective is used to characterize the trend of risks so as to provide predictive insights. To validate the newly identified risks, two 6.6-kW WEVC prototypes are built employing circular coils and DD coils, respectively. The experimental studies confirm the necessity of implementing thermal risk management strategies for magnetic coupler under misaligned conditions, such as enhanced cooling, including a wider range of materials for foreign object detection (FOD), expanding the FOD area, and so forth. |
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AbstractList | As wireless electric vehicle charging (WEVC) technology moves toward commercialization, understanding its associated risks is crucial, particularly with the trend toward high-power fast charging. In this article, thermal risks and factors exacerbating the risks in wireless electric vehicle chargers are investigated comprehensively, focusing on the magnetic coupler and foreign objects (FOs) intruding on the charging area. The power losses and temperatures of the coupler and FOs are obtained using a two-way electromagnetic-thermal coupled model, and the coupler will be assigned to a risk level according to the proposed four-temperature-level risk evaluation mechanism. In this model, practical considerations include coil types, misalignments, FO materials, ambient temperatures, etc. Moreover, a dynamic perspective is used to characterize the trend of risks so as to provide predictive insights. To validate the newly identified risks, two 6.6-kW WEVC prototypes are built employing circular coils and DD coils, respectively. The experimental studies confirm the necessity of implementing thermal risk management strategies for magnetic coupler under misaligned conditions, such as enhanced cooling, including a wider range of materials for foreign object detection (FOD), expanding the FOD area, and so forth. |
Author | Jian, Linni Zhao, Qingyu Niu, Shuangxia Niu, Songyan |
Author_xml | – sequence: 1 givenname: Songyan orcidid: 0000-0002-2412-8207 surname: Niu fullname: Niu, Songyan email: 11749179@mail.sustech.edu.cn organization: Jiaxing Research Institute, Southern University of Science and Technology, Jiaxing, China – sequence: 2 givenname: Qingyu orcidid: 0000-0002-5732-5127 surname: Zhao fullname: Zhao, Qingyu email: 12232136@mail.sustech.edu.cn organization: Jiaxing Research Institute, Southern University of Science and Technology, Jiaxing, China – sequence: 3 givenname: Shuangxia orcidid: 0000-0001-5934-616X surname: Niu fullname: Niu, Shuangxia email: eesxniu@polyu.edu.hk organization: The Hong Kong Polytechnic University, Hong Kong – sequence: 4 givenname: Linni orcidid: 0000-0002-5246-2835 surname: Jian fullname: Jian, Linni email: jianln@sustech.edu.cn organization: Southern University of Science and Technology, Shenzhen, China |
BookMark | eNqFkMtOwzAQRS0EEq9-ASwssW7xM46XVWmhCASCAsvIuJPWkDjBDpXY8uUYihBiw2pmMedezdlFm77xgNABJQNKiT4-H9_OpuMBI0wMuKCKCbGBdliWq75Wgm_-7Fxuo16MT4QQJimjROyg9yEeNXUbYAk-uhXgqV9B7NzCdK7xuCnxbAmhNhW-cfE5YufxgwtQQYx4fI9HSxMWEGIKSfgcgvMLfNsmOBGXLprKLXwNvsOT0NTY4JM3b2pn8XWCWrBdqtxHW6WpIvS-5x66m4xno7P-xdXpdDS86FvG8q6fs1xRKfljLnMuiC0VySzJtNYll1YTrrSyMpPzfC5tqYmVBoRl5aNiligo-R46Wue2oXl5TU8WT81r8Kmy4JQqyrMso-mKr69saGIMUBZtcLUJbwUlxafvYu27-PRdfPtOlP5DWdd9KeyCcdU_7OGadQDwq01muZCEfwBUwZEn |
CitedBy_id | crossref_primary_10_3390_electronics14010200 crossref_primary_10_3390_en17236009 crossref_primary_10_3390_pr13030782 crossref_primary_10_3390_electronics14010015 crossref_primary_10_3390_electronics14020262 crossref_primary_10_3390_en18020237 crossref_primary_10_3390_pr13010181 |
Cites_doi | 10.1109/ACCESS.2018.2817655 10.1109/JESTIE.2022.3196818 10.1109/TPEL.2019.2903788 10.1109/APEMC.2016.7523010 10.1016/j.rser.2019.109302 10.1109/TPEL.2020.3013191 10.1109/jestie.2023.3339436 10.1109/COMPEL.2019.8769626 10.1007/s43236-021-00369-8 10.1109/JESTIE.2022.3204485 10.1109/WoW51332.2021.9462857 10.1109/TPEL.2019.2936249 10.1109/JESTPE.2023.3293096 10.1109/TIE.2022.3150114 10.1109/TIE.2021.3055186 10.1109/TMAG.2023.3286412 10.3390/su13179785 10.1109/JESTIE.2021.3125616 10.1109/ACCESS.2020.3025586 10.1016/j.conbuildmat.2023.131783 10.1016/j.etran.2019.04.002 10.1016/j.measurement.2020.108493 10.1109/TVT.2019.2944841 10.4271/j2954_202010 10.1109/TMAG.2019.2896780 10.1109/TIE.2020.2970652 10.1016/j.jclepro.2019.118561 10.1109/JESTIE.2021.3051550 10.1016/j.apenergy.2020.115344 10.1109/TIE.2019.2899565 10.1109/TIE.2023.3292870 10.1109/IMCET.2018.8603027 10.1016/j.isatra.2022.04.016 |
ContentType | Journal Article |
Copyright | Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024 |
Copyright_xml | – notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2024 |
DBID | 97E RIA RIE AAYXX CITATION 7SP 8FD L7M |
DOI | 10.1109/JESTIE.2024.3417244 |
DatabaseName | IEEE All-Society Periodicals Package (ASPP) 2005–Present IEEE All-Society Periodicals Package (ASPP) 1998–Present IEEE Electronic Library (IEL) CrossRef Electronics & Communications Abstracts Technology Research Database Advanced Technologies Database with Aerospace |
DatabaseTitle | CrossRef Technology Research Database Advanced Technologies Database with Aerospace Electronics & Communications Abstracts |
DatabaseTitleList | Technology Research Database |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 2687-9743 |
EndPage | 1571 |
ExternalDocumentID | 10_1109_JESTIE_2024_3417244 10568450 |
Genre | orig-research |
GroupedDBID | 0R~ 97E AARMG AASAJ AAWTH ABAZT ABJNI ABQJQ ABVLG AGQYO AHBIQ AKJIK AKQYR ALMA_UNASSIGNED_HOLDINGS ATWAV BEFXN BFFAM BGNUA BKEBE BPEOZ EBS IFIPE JAVBF OCL RIA RIE AAYXX CITATION 7SP 8FD L7M |
ID | FETCH-LOGICAL-c228t-82871553b858340cf706c06999f35c903797c565d8d5cf90c5ae4c2fb72c07ef3 |
IEDL.DBID | RIE |
ISSN | 2687-9735 |
IngestDate | Mon Jun 30 15:15:16 EDT 2025 Tue Jul 01 00:56:34 EDT 2025 Thu Apr 24 23:12:44 EDT 2025 Wed Aug 27 02:18:05 EDT 2025 |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 4 |
Language | English |
License | https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html https://doi.org/10.15223/policy-029 https://doi.org/10.15223/policy-037 |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-c228t-82871553b858340cf706c06999f35c903797c565d8d5cf90c5ae4c2fb72c07ef3 |
Notes | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 14 |
ORCID | 0000-0001-5934-616X 0000-0002-5732-5127 0000-0002-2412-8207 0000-0002-5246-2835 |
PQID | 3117136661 |
PQPubID | 5075792 |
PageCount | 12 |
ParticipantIDs | proquest_journals_3117136661 crossref_citationtrail_10_1109_JESTIE_2024_3417244 crossref_primary_10_1109_JESTIE_2024_3417244 ieee_primary_10568450 |
ProviderPackageCode | CITATION AAYXX |
PublicationCentury | 2000 |
PublicationDate | 2024-10-01 |
PublicationDateYYYYMMDD | 2024-10-01 |
PublicationDate_xml | – month: 10 year: 2024 text: 2024-10-01 day: 01 |
PublicationDecade | 2020 |
PublicationPlace | New York |
PublicationPlace_xml | – name: New York |
PublicationTitle | IEEE journal of emerging and selected topics in industrial electronics (Print) |
PublicationTitleAbbrev | JESTIE |
PublicationYear | 2024 |
Publisher | IEEE The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher_xml | – name: IEEE – name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
References | ref13 ref35 ref34 ref15 ref14 (ref33) 2023 ref36 ref31 ref30 ref11 ref10 ref32 ref2 ref1 ref17 ref16 ref19 Lai (ref4) 2023; 18 ref18 (ref12) 2023 ref24 ref23 ref26 ref25 ref20 ref22 ref21 ref28 ref27 ref29 ref8 ref7 ref9 ref3 ref6 ref5 |
References_xml | – ident: ref29 doi: 10.1109/ACCESS.2018.2817655 – ident: ref31 doi: 10.1109/JESTIE.2022.3196818 – ident: ref34 doi: 10.1109/TPEL.2019.2903788 – ident: ref25 doi: 10.1109/APEMC.2016.7523010 – ident: ref1 doi: 10.1016/j.rser.2019.109302 – ident: ref5 doi: 10.1109/TPEL.2020.3013191 – ident: ref32 doi: 10.1109/jestie.2023.3339436 – ident: ref24 doi: 10.1109/COMPEL.2019.8769626 – ident: ref27 doi: 10.1007/s43236-021-00369-8 – ident: ref30 doi: 10.1109/JESTIE.2022.3204485 – ident: ref13 doi: 10.1109/WoW51332.2021.9462857 – ident: ref22 doi: 10.1109/TPEL.2019.2936249 – ident: ref8 doi: 10.1109/JESTPE.2023.3293096 – ident: ref18 doi: 10.1109/TIE.2022.3150114 – ident: ref10 doi: 10.1109/TIE.2021.3055186 – ident: ref16 doi: 10.1109/TMAG.2023.3286412 – year: 2023 ident: ref12 article-title: Wiferion productsSmart inductive wireless charging – ident: ref35 doi: 10.3390/su13179785 – ident: ref3 doi: 10.1109/JESTIE.2021.3125616 – volume: 18 start-page: 86 issue: 1 year: 2023 ident: ref4 article-title: Analysis of frequency bifurcation of dual load magnetic resonance S-LCL wireless charging system publication-title: Chin. J. Elect. Eng. – ident: ref14 doi: 10.1109/ACCESS.2020.3025586 – ident: ref11 doi: 10.1016/j.conbuildmat.2023.131783 – year: 2023 ident: ref33 article-title: Physical and mechanical properties of resistance copper – ident: ref21 doi: 10.1016/j.etran.2019.04.002 – ident: ref20 doi: 10.1016/j.measurement.2020.108493 – ident: ref26 doi: 10.1109/TVT.2019.2944841 – ident: ref36 doi: 10.4271/j2954_202010 – ident: ref15 doi: 10.1109/TMAG.2019.2896780 – ident: ref7 doi: 10.1109/TIE.2020.2970652 – ident: ref17 doi: 10.1016/j.jclepro.2019.118561 – ident: ref2 doi: 10.1109/JESTIE.2021.3051550 – ident: ref9 doi: 10.1016/j.apenergy.2020.115344 – ident: ref6 doi: 10.1109/TIE.2019.2899565 – ident: ref19 doi: 10.1109/TIE.2023.3292870 – ident: ref28 doi: 10.1109/IMCET.2018.8603027 – ident: ref23 doi: 10.1016/j.isatra.2022.04.016 |
SSID | ssj0002512104 |
Score | 2.3728006 |
Snippet | As wireless electric vehicle charging (WEVC) technology moves toward commercialization, understanding its associated risks is crucial, particularly with the... |
SourceID | proquest crossref ieee |
SourceType | Aggregation Database Enrichment Source Index Database Publisher |
StartPage | 1560 |
SubjectTerms | Ambient temperature Coils Commercialization Couplers Electric power loss Electric vehicle (EV) Electric vehicle charging Electric vehicles foreign object detection (FOD) Heating systems inductive power transfer Industrial electronics Magnetic cores Misalignment Object recognition Risk levels Risk management temperature Thermal analysis Wireless communication |
Title | A Comprehensive Investigation of Thermal Risks in Wireless EV Chargers Considering Spatial Misalignment From a Dynamic Perspective |
URI | https://ieeexplore.ieee.org/document/10568450 https://www.proquest.com/docview/3117136661 |
Volume | 5 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1NT9wwELUKp_YApQWxLVRz6LFZnMSJkyMquwIkUFWg4hbFExtWLEm1Hwd65Jcz42TpUgTqzQfbsjTjmTf2zDwhvsamwqiMMTDK6UDlzgYmK5OAvInl_m_oKn6HPDlNDy_U8WVy2RWr-1oYa61PPrN9Hvq__KrBOT-V7TFLfKY4Ql-hyK0t1np8UGFHHXq6wCili5PrOOm6DIUy3zsenJ0fDSgejFSfDLcmr_bEE3lqlWf22DuZ4bo4XRyvzS256c9npo9__unc-N_nfy_WOrgJ-61-bIg3tv4g3i01Ifwo7veBjcLEXre57LDUeqOpoXFAqkTmeww_R9ObKYxq4JTZMZlIGPwC_q-_IgwJC-pP2hSY6JgUG05GU8L5Vz7jAIaT5hZKOLiry9sRwo-_ZZ6b4mI4OP9-GHTMDAFGUTbj2nPNhEMmS7KYBaplijIlsOniBHMZ61wjQcUqqxJ0ucSktAojZ3SEUlsXb4nVuqnttgCHqLWWBtNKKmVUmYfGGUNAyWmLqeuJaCGlAru25cyeMS58-CLzohVtwaItOtH2xLfHRb_brh2vT99kYS1NbeXUEzsLfSi6qz0t4jCkwJ6ivvDTC8s-i7e8e5vytyNWZ5O53SXoMjNfvMo-AChC6rk |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1Lb9QwELZQOQAHyqOIpQXmwJFsncSJk2MFu9qW7grBFvUWxRO7rLpN0D4OcOwv74yTLQsIxC0H20k043nYM98nxJvYVBiVMQZGOR2o3NnAZGUSkDexjP-GruJzyPEkHZ2pk_PkvGtW970w1lpffGb7_Ojv8qsG13xUdsgs8ZniDP0uOf4kbNu1bo9U2FWHnjAwSmnr5DpOOpyhUOaHJ4PP0-MBZYSR6pPp1uTXfvFFnlzlD4vs3cxwV0w2H9hWl1z21yvTxx-_YTf-9x88Eg-7gBOOWg15LO7Y-ol4sAVD-FRcHwGbhYX92lazwxb4RlND44CUiQz4HD7NlpdLmNXARbNzMpIw-AJ8Y39BUSRsyD9pUWCqY1JtGM-WFOlf-JoDGC6aKyjh_fe6vJohfPzZ6LknzoaD6btR0HEzBBhF2Yq7zzVTDpksyWIWqZYpypTCTRcnmMtY5xopWKyyKkGXS0xKqzByRkcotXXxM7FTN7V9LsAhaq2lwbSSShlV5qFxxlCo5LTF1PVEtJFSgR1wOfNnzAufwMi8aEVbsGiLTrQ98fZ20rcWt-Pfw_dYWFtDWzn1xMFGH4pucy-LOAwptae8L3zxl2mvxb3RdHxanB5PPuyL-_ymtgDwQOysFmv7kgKZlXnl1fcGjQfuAg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=A+Comprehensive+Investigation+of+Thermal+Risks+in+Wireless+EV+Chargers+Considering+Spatial+Misalignment+From+a+Dynamic+Perspective&rft.jtitle=IEEE+journal+of+emerging+and+selected+topics+in+industrial+electronics+%28Print%29&rft.au=Niu%2C+Songyan&rft.au=Zhao%2C+Qingyu&rft.au=Niu%2C+Shuangxia&rft.au=Linni+Jian&rft.date=2024-10-01&rft.pub=The+Institute+of+Electrical+and+Electronics+Engineers%2C+Inc.+%28IEEE%29&rft.issn=2687-9735&rft.eissn=2687-9743&rft.volume=5&rft.issue=4&rft.spage=1560&rft_id=info:doi/10.1109%2FJESTIE.2024.3417244&rft.externalDBID=NO_FULL_TEXT |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2687-9735&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2687-9735&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2687-9735&client=summon |