Intelligent manufacturing impact of vocational high school education through industrial-academic cooperation plan

• Published in: International journal of electrical engineering & education Vol. 62; no. 3; pp. 214 - 228
• Main Authors: Yen, Jung-Nan, Chen, Hsin-Hung, Chen, Long-Hui, Hsu, Hsiang-Chen, Lee, Yu-Chen
• Format: Journal Article
• Language: English
• Published: London, England SAGE Publications 01.07.2025; Sage Publications Ltd
• Subjects: Career and Technical Education; Colleges & universities; Cooperation; Education; Electronics; Enrollment Rate; Factories; Integrated Activities; Intelligence; Intelligent manufacturing systems; Learning; Learning Activities; Learning Processes; Management methods; Manpower; Manufacturing; Outsourcing; Segmentation; Training; Industrial-academic cooperation; work-integrated learning; outsourcing semiconductor assembly and testing; vocational education; intelligent simulation training system
• ISSN: 0020-7209; 2050-4578
• DOI: 10.1177/0020720918791424

The rapid advancement of information and communication technology enhances the global outsourcing semiconductor assembly and testing industry to transform into intelligent factories, in which outstanding technicians can take adaptive behaviours in the manufacturing process. However, the vocational education nowadays encounters several challenges including “learning-application gap” and “impact of low fertility rate,” and thus fails to provide sufficient manpower for intelligent manufacturing. To tackle the issue of manpower shortage, this research presented and adopted segmentation and targeting methods, especially in combination with the subsequent peer experiences model with the learning process of “intelligent simulation training system.” Parametric studies have been conducted on the “Industrial-Academic Cooperation Plan” featuring work-integrated learning to solve the predicaments mentioned above. The research demonstrated that the model of taking the learning process of intelligent simulation training system as variable for subsequent peer experiences could be used to conquer the problem of “learning-application gap.” Moreover, the research results showed the electronics department using this model in case study enjoyed an enrolment rate 24% higher than that of other electronics departments of private university in the same period. Obviously, this “Industrial-Academic Cooperation Plan” which adopts the marketing management methods “segmentation” and “targeting” is different from “offering education for everyone”; instead, it is the research results that implement “the enrolment mode with adaptive guidance” that provides the outsourcing semiconductor assembly and testing industry with quality and steady workforce required to introduce intelligent manufacturing into factories.