Study of Interfacial Moisture Diffusion at Cu/Epoxy Interface by FTIR-MIR Technique

• Published in: 2007 Proceedings 57th Electronic Components and Technology Conference pp. 1782 - 1787
• Main Authors: Chan, E.K.L., Yuen, M.M.F.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2007
• Subjects: Calibration; Copper; Delamination; Fourier transforms; Humidity; Infrared spectra; Integrated circuit packaging; Moisture measurement; Qualifications; Reflection

The delamination at the copper lead frame and the epoxy interface adversely affects the reliability of IC packages and this is a common failure mode during the qualification process. One of the factors governing the interfacial delamination is the moisture content at the interface. This study furthe...