Au-Free AlGaN/GaN HEMT on Flexible Kapton Substrate

In this article, we report on the electrical performance of AlGaN/GaN high-electron mobility transistors (HEMTs) fabricated using gold (Au)-free process, after being transferred onto flexible Kapton tape. The transfer process followed in this work can be easily scaled-up to wafer level and involves...

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Published inIEEE transactions on electron devices Vol. 69; no. 8; pp. 4212 - 4217
Main Authors Niranjan, S, Muralidharan, R., Sen, Prosenjit, Nath, Digbijoy N.
Format Journal Article
LanguageEnglish
Published New York IEEE 01.08.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Abstract In this article, we report on the electrical performance of AlGaN/GaN high-electron mobility transistors (HEMTs) fabricated using gold (Au)-free process, after being transferred onto flexible Kapton tape. The transfer process followed in this work can be easily scaled-up to wafer level and involves a relatively simple process of epoxy bonding of the thin device layer onto the Kapton substrate. Electrical characteristics of the flexible HEMT indicate 5%-10% higher ON-current when bent with a radius of curvature of 2.1 cm (at low drain bias voltages), while the OFF-state performance remains unaffected. Initially, 2-DEG properties such as field-effect mobility and carrier concentration have been extracted. While FATFET measurements indicate negligible change in field-effect mobility, <inline-formula> <tex-math notation="LaTeX">{C} </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">{V} </tex-math></inline-formula> measurements indicate <inline-formula> <tex-math notation="LaTeX">\sim 10 </tex-math></inline-formula>% reduction in 2-DEG concentration after transfer. The comparison of the electrical characteristics of Au-free HEMTs indicates <inline-formula> <tex-math notation="LaTeX">\sim 50 </tex-math></inline-formula>% reduction in the ON-current of the transferred devices. This is attributed to heating of the transistor channel caused due to low thermal conductivity of the polymer Kapton tape. Electrical characteristics of the flexible HEMT carried out under drain pulsing further support the above observation. This work is among one of the few reports on Au-free AlGaN/GaN HEMT operation on flexible Kapton tape.
AbstractList In this article, we report on the electrical performance of AlGaN/GaN high-electron mobility transistors (HEMTs) fabricated using gold (Au)-free process, after being transferred onto flexible Kapton tape. The transfer process followed in this work can be easily scaled-up to wafer level and involves a relatively simple process of epoxy bonding of the thin device layer onto the Kapton substrate. Electrical characteristics of the flexible HEMT indicate 5%-10% higher ON-current when bent with a radius of curvature of 2.1 cm (at low drain bias voltages), while the OFF-state performance remains unaffected. Initially, 2-DEG properties such as field-effect mobility and carrier concentration have been extracted. While FATFET measurements indicate negligible change in field-effect mobility, <inline-formula> <tex-math notation="LaTeX">{C} </tex-math></inline-formula>-<inline-formula> <tex-math notation="LaTeX">{V} </tex-math></inline-formula> measurements indicate <inline-formula> <tex-math notation="LaTeX">\sim 10 </tex-math></inline-formula>% reduction in 2-DEG concentration after transfer. The comparison of the electrical characteristics of Au-free HEMTs indicates <inline-formula> <tex-math notation="LaTeX">\sim 50 </tex-math></inline-formula>% reduction in the ON-current of the transferred devices. This is attributed to heating of the transistor channel caused due to low thermal conductivity of the polymer Kapton tape. Electrical characteristics of the flexible HEMT carried out under drain pulsing further support the above observation. This work is among one of the few reports on Au-free AlGaN/GaN HEMT operation on flexible Kapton tape.
In this article, we report on the electrical performance of AlGaN/GaN high-electron mobility transistors (HEMTs) fabricated using gold (Au)-free process, after being transferred onto flexible Kapton tape. The transfer process followed in this work can be easily scaled-up to wafer level and involves a relatively simple process of epoxy bonding of the thin device layer onto the Kapton substrate. Electrical characteristics of the flexible HEMT indicate 5%–10% higher ON-current when bent with a radius of curvature of 2.1 cm (at low drain bias voltages), while the OFF-state performance remains unaffected. Initially, 2-DEG properties such as field-effect mobility and carrier concentration have been extracted. While FATFET measurements indicate negligible change in field-effect mobility, [Formula Omitted]–[Formula Omitted] measurements indicate [Formula Omitted]% reduction in 2-DEG concentration after transfer. The comparison of the electrical characteristics of Au-free HEMTs indicates [Formula Omitted]% reduction in the ON-current of the transferred devices. This is attributed to heating of the transistor channel caused due to low thermal conductivity of the polymer Kapton tape. Electrical characteristics of the flexible HEMT carried out under drain pulsing further support the above observation. This work is among one of the few reports on Au-free AlGaN/GaN HEMT operation on flexible Kapton tape.
Author Muralidharan, R.
Niranjan, S
Sen, Prosenjit
Nath, Digbijoy N.
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SubjectTerms AlGaN/GaN high-electron mobility transistors (HEMT)
Aluminum gallium nitride
Aluminum gallium nitrides
Au-free process
Carrier density
CMOS compatibility
Electrical resistivity
flexible electronics
Gallium nitrides
HEMTs
High electron mobility transistors
Kapton
Kapton (trademark)
Logic gates
Performance evaluation
Polyimide resins
Radius of curvature
Reduction
Semiconductor devices
Silicon
Substrates
Thermal conductivity
Wide band gap semiconductors
Title Au-Free AlGaN/GaN HEMT on Flexible Kapton Substrate
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