Thermal transformations of the Cu(dpm)2 complex in inert and reducing atmospheres

• Published in: Inorganic materials Vol. 44; no. 7; pp. 692 - 696
• Main Authors: Bakovets, V. V., Mikheev, A. N., Prokhorova, S. A., Filatova, I. Yu
• Format: Journal Article
• Language: English
• Published: Dordrecht SP MAIK Nauka/Interperiodica 01.07.2008
• Subjects: Chemistry; Chemistry and Materials Science; Copper; Hydrogen reduction; Industrial Chemistry/Chemical Engineering; Inert; Inorganic Chemistry; Materials Science; Nickel; Reducing atmospheres; Surface chemistry; Transformations; Vaporization; Copper Complex; Copper Deposition; Differential Thermal Analysis; Apparent Activation Energy; Differential Thermal Analysis Curve
• ISSN: 0020-1685; 1608-3172
• DOI: 10.1134/S0020168508070042

The transformation kinetics of the Cu(dpm) 2 complex have been studied by thermal analysis under steady-state conditions. The results indicate that, in noncatalytic systems, the dominant process in the temperature range 150–300°C is vaporization of the complex, with an enthalpy of 62 ± 12 kJ/mol. In hydrogen atmosphere on nickel and copper surfaces, responsible for the formation of adsorbed atomic hydrogen, the dominant process is copper reduction. Weight loss data obtained in thermoanalytical runs between 185 and 220°C were used to separate the contribution of the chemical process and to evaluate the apparent activation energies for the hydrogen reduction of copper on nickel and copper surfaces: 32 ± 6 and 48 ± 9 kJ/mol, respectively.