Evaluation of Creep Deformation by Indentation Test with a Constant Depth - Applicability for Inhomogeneous Materials

• Published in: Key Engineering Materials Vol. 734; pp. 251 - 259
• Main Authors: Sasakir, Katsuhiko, Fujiki, Hiroyuki, Takita, Atsuko, Ohguchi, Ken-Ichi
• Format: Journal Article
• Language: English
• Published: Trans Tech Publications Ltd 01.04.2017
• Subjects: Creep strength; Deformation; Design analysis; Hardness tests; Homogeneity; Mathematical models; Solders; Test procedures; Homogeneity; Lead-Free Solder; Indentation Test; Creep Deformation; FEM

In design of the electronic device, FEM analyses considering the creep deformation of solder joints in-situ should be conducted to evaluate the strength reliability. The indentation test is one of effective method to evaluate the creep deformation in microscopic region. However, the result obtained...