Practical EBG application to multilayer PCB: impact on signal integrity

In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S...

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Published inIEEE electromagnetic compatibility magazine Vol. 2; no. 2; pp. 82 - 87
Main Authors Nisanci, M. H., De Paulis, F., Di Febo, Danilo, Orlandi, A.
Format Journal Article Magazine Article
LanguageEnglish
Published New York IEEE 01.01.2013
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Biomedical signal processing
Electromagnetic compatibility
electromagneticband gap structures
Metamaterials
Photonic band gap
printed circuit boards
Printed circuits
signal integrity
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Abstract In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn.
AbstractList   In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn.
In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn.
Author Nisanci, M. H.
De Paulis, F.
Di Febo, Danilo
Orlandi, A.
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10.1007/978-1-4757-3640-3
10.1109/ISEMC.2012.6351676
10.1109/MEMC.2012.6347053
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Snippet In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band...
  In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band...
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SubjectTerms Biomedical signal processing
Electromagnetic compatibility
electromagneticband gap structures
Metamaterials
Photonic band gap
printed circuit boards
Printed circuits
signal integrity
Title Practical EBG application to multilayer PCB: impact on signal integrity
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