Practical EBG application to multilayer PCB: impact on signal integrity

In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S...

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Published inIEEE electromagnetic compatibility magazine Vol. 2; no. 2; pp. 82 - 87
Main Authors Nisanci, M. H., De Paulis, F., Di Febo, Danilo, Orlandi, A.
Format Journal Article Magazine Article
LanguageEnglish
Published New York IEEE 01.01.2013
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Abstract In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn.
AbstractList   In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn.
In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band gap (EBG) structure for noise isolation in high speed digital printed circuit boards (PCB) are studied. The performances in terms of |S11|, |S21|, |Sdd21| and |Scc21| are considered in function of the stack up cross section and position above the EBG. Practical considerations for the layout strategies are drawn.
Author Nisanci, M. H.
De Paulis, F.
Di Febo, Danilo
Orlandi, A.
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10.1007/978-1-4757-3640-3
10.1109/ISEMC.2012.6351676
10.1109/MEMC.2012.6347053
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ref11
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(ref7) 2013
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  ident: ref13
  article-title: Design and experimental validation of compact common mode filter based on EBG technology
  publication-title: Proc IEC Design-Con 2013
  contributor:
    fullname: gu
– year: 0
  ident: ref10
  article-title: Electromagnetic Band Gap Structure for Common Mode Filtering of High Speed Differential Signals
  publication-title: Proc IEC DesignCon 2011
  contributor:
    fullname: de paulis
– year: 0
  ident: ref12
  article-title: Min-iaturization of Common Mode Filter Based on EBG Patch Resonance
  publication-title: Proc IEC DesignCon 2012
  contributor:
    fullname: de paulis
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  doi: 10.1109/LMWC.2009.2027062
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  doi: 10.1109/MEMC.2012.6347053
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  publication-title: Transmission Lines in Digital Systems for EMC Practitioners
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    fullname: paul
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  doi: 10.2528/PIERB11100402
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  ident: ref7
  publication-title: Computer Simulation technologies CST Studio Suite 2013
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  doi: 10.1109/TEMC.2010.2051549
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  ident: ref5
  publication-title: High-Speed Digital Design A Handbook of Black Magic
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Snippet In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band...
  In this paper, signal transmission performance of single ended and differential striplines between two parallel GND planes with embedded electromagnetic band...
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SubjectTerms Biomedical signal processing
Electromagnetic compatibility
electromagneticband gap structures
Metamaterials
Photonic band gap
printed circuit boards
Printed circuits
signal integrity
Title Practical EBG application to multilayer PCB: impact on signal integrity
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