A Review of Atomic Layer Deposition for Nanoscale Devices

• Published in: Journal of mechatronics, electrical power & vehicular technology Vol. 3; no. 2; pp. 65 - 72
• Main Authors: Riyanto, Edy, Rijanto, Estiko, Prawara, Budi
• Format: Journal Article
• Language: English
• Published: Indonesian Institute of Sciences 07.12.2012
• Subjects: thin coating, atomic layer deposition, nanoscale devices
• DOI: 10.14203/j.mev.2012.v3.65-72
• ISSN: 2087-3379

Atomic layer deposition (ALD) is a thin film growth technique that utilizes alternating, self-saturation chemical reactions between gaseous precursors to achieve a deposited nanoscale layers. It has recently become a subject of great interest for ultrathin film deposition in many various applications such as microelectronics, photovoltaic, dynamic random access memory (DRAM), and microelectromechanic system (MEMS). By using ALD, the conformability and extreme uniformity of layers can be achieved in low temperature process. It facilitates to be deposited onto the surface in many variety substrates that have low melting temperature. Eventually it has advantages on the contribution to the wider nanodevices.