Investigation of Mechanical Stability during Electro-thermal Annealing in a 3D NAND Flash Memory String

Saved in:
Bibliographic Details
Published inJournal of semiconductor technology and science Vol. 22; no. 3; pp. 139 - 145
Main Authors Kim, Yu-Jin, Park, Jun-Young
Format Journal Article
LanguageEnglish
Published 대한전자공학회 30.06.2022
Subjects
Online AccessGet full text
ISSN1598-1657
2233-4866
DOI10.5573/JSTS.2022.22.3.139

Cover

Loading…
Author Jun-Young Park
Yu-Jin Kim
Author_xml – sequence: 1
  givenname: Yu-Jin
  surname: Kim
  fullname: Kim, Yu-Jin
– sequence: 2
  givenname: Jun-Young
  surname: Park
  fullname: Park, Jun-Young
BookMark eNp9kD1PwzAQhi1UJNrCH2Dywpjij9iOx6ofUATt0DJHF8dpjVIHOQap_56EIgYGpFe64e55pXtGaOAbbxG6pWQihOL3T9vddsIIY5MufEK5vkBDxjhP0kzKARpSobOESqGu0Kht3wiRmdJqiPYr_2nb6PYQXeNxU-EXaw7gnYEabyMUrnbxhMuP4PweL2prYmiSeLDh2B1MvbdQ9xvnMWA-x-vpeo6XNbSHrujYhFNX0qPX6LKCurU3P3OMXpeL3ewxed48rGbT58QwomICIqVaKxBASyi4ZJJLbQWvGBRKgRWZKmWqS014AbLQouTGpFZyozJW8oqPUXbuNaFp22Cr3Lj4_VsM4OqckrwXlvfC8l5Y3oXnnbAOZX_Q9-COEE7_Q3dnyHeGjrZ08EutN_MFpSQjWhD-BV9ifa4
CitedBy_id crossref_primary_10_1016_j_microrel_2023_115276
ContentType Journal Article
DBID DBRKI
TDB
AAYXX
CITATION
DOI 10.5573/JSTS.2022.22.3.139
DatabaseName DBPIA - 디비피아
Nurimedia DBPIA Journals
CrossRef
DatabaseTitle CrossRef
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2233-4866
EndPage 145
ExternalDocumentID 10_5573_JSTS_2022_22_3_139
NODE11080950
GroupedDBID 9ZL
ADDVE
AENEX
ALMA_UNASSIGNED_HOLDINGS
C1A
DBRKI
FRP
GW5
HH5
JDI
KVFHK
MZR
OK1
TDB
TR2
ZZE
AAYXX
CITATION
ID FETCH-LOGICAL-c207t-a541997a5a1dab3626369e53f2ab77ae587d649d903ba6b95d3cc4e63c782d3f3
ISSN 1598-1657
IngestDate Tue Jul 01 02:28:33 EDT 2025
Thu Apr 24 23:01:53 EDT 2025
Sun Mar 09 07:50:37 EDT 2025
IsPeerReviewed false
IsScholarly true
Issue 3
Keywords Joule heat
mechanical stress
degradation
Electro-thermal annealing
3D NAND flash memory
reliability
Language English
LinkModel OpenURL
MergedId FETCHMERGED-LOGICAL-c207t-a541997a5a1dab3626369e53f2ab77ae587d649d903ba6b95d3cc4e63c782d3f3
PageCount 7
ParticipantIDs crossref_citationtrail_10_5573_JSTS_2022_22_3_139
crossref_primary_10_5573_JSTS_2022_22_3_139
nurimedia_primary_NODE11080950
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2022-06-30
PublicationDateYYYYMMDD 2022-06-30
PublicationDate_xml – month: 06
  year: 2022
  text: 2022-06-30
  day: 30
PublicationDecade 2020
PublicationTitle Journal of semiconductor technology and science
PublicationYear 2022
Publisher 대한전자공학회
Publisher_xml – name: 대한전자공학회
SSID ssj0068797
Score 2.2380095
SourceID crossref
nurimedia
SourceType Enrichment Source
Index Database
Publisher
StartPage 139
Title Investigation of Mechanical Stability during Electro-thermal Annealing in a 3D NAND Flash Memory String
URI https://www.dbpia.co.kr/journal/articleDetail?nodeId=NODE11080950
Volume 22
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV1Lb5wwELa26aHtoepTTdpGPpTTCgoYAz7ugyhKlW2lJFJuyMamjZRlq3T3kP6Y_tbOYHDYpOpLQsjy2pid-RjPwDwIeQeWsYzzmvkqCpUP9oaBR6oWvkSfQhFqnVQYnHy8SA_PkqNzfj4a_Rh4LW3WKqi-_zKu5H-4Cn3AV4yS_QfOuotCB7SBv3AGDsP5r3g8SJJh1b5jg4G8Ld1Bi2z9Xq_7SMTCFrzxUeNbImNAwsrLLqRFjtl8vMBUUwegTn-BCy3x4_vJ-qrf2u4qsN_Qr37VYMJYdFV07-jb7xHdzuqEysY_gmU-XCydy86m8VtRM_7Uhwt1Lx_Abu085Tq4eMXUy2fok1HMPcE9MfOKmTcJvTzBhig8AT9NvCnzprwfI9rGBCYO5a4AYza1uaoD0_aB4sL8JLdFWXphHccDULKB5I1sTqRuE49sjsrb-wPnGeapAJl3EuDfCeBggZu6lXd78XFeYIwE6KDhPXI_BjMkbgW_M6_SPLPFe_qbt0FZuMj7u0tsKT4Pmg1WbwARMNBmTp-Qxx0X6cRi6ikZmeYZeTRITvmcfN5CF13V9AZd1KGLWnTRW-iiDl30oqGSsjlFdNEWXdSii1p0vSBnB8Xp7NDvynL4VRxma1_yBL2TJJeRlqpNZ5QKw1kdS5Vl0vA802kitAiZkqkSXLOqSkzKKtBGNavZS7LTrBrzitA4qgQ3KgMlKU4qHSqhtchVmujQyEjluyTqaVZWXc56LJ1yWYLtinQukc4l0rmEg5VA510ydnO-2owtvx2971jhhg9Zv_enAa_Jw5sn4w3ZWV9tzFtQVNdqv0XLT7Llih8
linkProvider ABC ChemistRy
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Investigation+of+Mechanical+Stability+during+Electro-thermal+Annealing+in+a+3D+NAND+Flash+Memory+String&rft.jtitle=Journal+of+semiconductor+technology+and+science&rft.au=Yu-Jin+Kim&rft.au=Jun-Young+Park&rft.date=2022-06-30&rft.pub=%EB%8C%80%ED%95%9C%EC%A0%84%EC%9E%90%EA%B3%B5%ED%95%99%ED%9A%8C&rft.issn=1598-1657&rft.eissn=2233-4866&rft.volume=22&rft.issue=3&rft.spage=139&rft.epage=145&rft_id=info:doi/10.5573%2FJSTS.2022.22.3.139&rft.externalDocID=NODE11080950
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1598-1657&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1598-1657&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1598-1657&client=summon