APA (7th ed.) Citation

Kim, Y., & Park, J. (2022). Investigation of Mechanical Stability during Electro-thermal Annealing in a 3D NAND Flash Memory String. Journal of semiconductor technology and science, 22(3), 139-145. https://doi.org/10.5573/JSTS.2022.22.3.139

Chicago Style (17th ed.) Citation

Kim, Yu-Jin, and Jun-Young Park. "Investigation of Mechanical Stability During Electro-thermal Annealing in a 3D NAND Flash Memory String." Journal of Semiconductor Technology and Science 22, no. 3 (2022): 139-145. https://doi.org/10.5573/JSTS.2022.22.3.139.

MLA (9th ed.) Citation

Kim, Yu-Jin, and Jun-Young Park. "Investigation of Mechanical Stability During Electro-thermal Annealing in a 3D NAND Flash Memory String." Journal of Semiconductor Technology and Science, vol. 22, no. 3, 2022, pp. 139-145, https://doi.org/10.5573/JSTS.2022.22.3.139.