Derivation of hyper-singular integral equations for thermoelectric bonded materials featuring a crack parallel to interface

• Published in: Mathematical Modeling and Computing Vol. 10; no. 4; pp. 1230 - 1238
• Main Authors: Mohd Nordin, M. H. I., Hamzah, K. B., Khashiie, N. S., Waini, I., Zainal, N. A., Sayed Nordin, S. K.
• Format: Journal Article
• Language: English
• Published: 2023

In this paper, the derivation of hyper-singular integral equations (HSIEs) for thermoelectric bonded materials (TEBM) featuring a crack parallel to interface subject to in-plane shear stress τ∞xy was intensively studied. Generally, stress intensity factors (SIFs) were calculated using HSIEs with the...