Study on Various Film properties of Electroless Ultra-Thin Ni/Pd/Au Plating Process for Fine Cu Pattern - TERASHIMA, Hajime; KATO, Tomohito; YAGI, Kaoru; WATANABE, Hideto (Hyōmen gijutsu, 2022)
Keywords: Circuit boards; Copper; Electroless plating; Electroless Ultra-thin Ni/Pd/Au Plating; Electronic devices; Film thickness; Fine Cu Pattern; Gold; Metallizing; Nickel plating; Noble metals; Palladium; Plating; Precious metals; Printed circuits; Selectivity; Solder Mounting Characteristics; Unevenness; Wire Bonding Characteristics; Without Pd Catalyst Treatment