APA (7th ed.) Citation

TERASHIMA, H., KATO, T., YAGI, K., & WATANABE, H. (2022). Study on Various Film properties of Electroless Ultra-Thin Ni/Pd/Au Plating Process for Fine Cu Pattern. Hyōmen gijutsu, 73(3), 149-156. https://doi.org/10.4139/sfj.73.149

Chicago Style (17th ed.) Citation

TERASHIMA, Hajime, Tomohito KATO, Kaoru YAGI, and Hideto WATANABE. "Study on Various Film Properties of Electroless Ultra-Thin Ni/Pd/Au Plating Process for Fine Cu Pattern." Hyōmen Gijutsu 73, no. 3 (2022): 149-156. https://doi.org/10.4139/sfj.73.149.

MLA (9th ed.) Citation

TERASHIMA, Hajime, et al. "Study on Various Film Properties of Electroless Ultra-Thin Ni/Pd/Au Plating Process for Fine Cu Pattern." Hyōmen Gijutsu, vol. 73, no. 3, 2022, pp. 149-156, https://doi.org/10.4139/sfj.73.149.