Numerical Model of Aluminum Pitting Corrosion in a 1M Sodium Chloride Solution Using Secondary Current Distribution

• Published in: Journal of bio- and tribo-corrosion Vol. 10; no. 3
• Main Authors: Mouloudi, Meriyem, El Guerraf, Abdelqader, Chhiba, Mostafa, Chafi, Mohammed, Essahli, Mohamed
• Format: Journal Article
• Language: English
• Published: Cham Springer International Publishing 01.09.2024; Springer Nature B.V
• Subjects: Aluminum; Biomaterials; Chemistry and Materials Science; Corrosion; Corrosion and Coatings; Corrosion resistance; Current distribution; Deformation; Kinetics; Localized corrosion; Materials Science; Numerical models; Ohmic drop; Oxide coatings; Pitting (corrosion); Reaction kinetics; Sodium chloride; Solid Mechanics; Tribology; Finite element method; Numerical simulation; Pitting corrosion; Green environment; Sodium chloride; Aluminum metal
• ISSN: 2198-4220; 2198-4239
• DOI: 10.1007/s40735-024-00851-3

Aluminum finds applications in various industries that require enhanced corrosion resistance. However, this metal remains susceptible to various forms of deterioration, with the most common being localized corrosion. This type of corrosion is characterized by local degradation of the oxide film in sufficiently aggressive environments. In the present work, a two-dimensional (2D) model incorporating a distribution of secondary current with deformed geometry was employed to investigate the behavior of aluminum pitting corrosion in a 1 M sodium chloride solution. Specifically, the study focused on the kinetics of pitting corrosion, the geometric deformation occurring during the pit growth process, and the influence of electrolyte conductivity on the propagation of pitting corrosion. Conclusions drawn from numerical simulations reveal that ohmic drop determines the kinetics of corrosion propagation along the metal wall of the pit and, thereby serves as the principal factor controlling the progression of the pit.