Chen, J., Peng, Y., Wei, Y., Ding, Y., Dai, K., Liu, B., . . . Su, J. (2025). A mathematical model on improved material removal mechanism in fixed agglomerated diamond abrasive lapping. Precision engineering, 96, 822-839. https://doi.org/10.1016/j.precisioneng.2025.08.006
Chicago Style (17th ed.) CitationChen, Jiapeng, Yanan Peng, Ying Wei, Yulong Ding, Ke Dai, Bing Liu, Wenbo Bie, and Jianxiu Su. "A Mathematical Model on Improved Material Removal Mechanism in Fixed Agglomerated Diamond Abrasive Lapping." Precision Engineering 96 (2025): 822-839. https://doi.org/10.1016/j.precisioneng.2025.08.006.
MLA (9th ed.) CitationChen, Jiapeng, et al. "A Mathematical Model on Improved Material Removal Mechanism in Fixed Agglomerated Diamond Abrasive Lapping." Precision Engineering, vol. 96, 2025, pp. 822-839, https://doi.org/10.1016/j.precisioneng.2025.08.006.