Advanced back grinding of semiconductor wafers using an angle-feedback TTV compensation controller

• Published in: Precision engineering Vol. 96; pp. 851 - 863
• Main Authors: Hwang, Byung-Hyun, Park, Kyoung-Su
• Format: Journal Article
• Language: English
• Published: Elsevier Inc 01.10.2025
• Subjects: Angle-feedback; Auto TTV; Back grinding; Semiconductor; Total thickness variation; Total thickness variation; Semiconductor; Back grinding; Auto TTV; Angle-feedback
• ISSN: 0141-6359
• DOI: 10.1016/j.precisioneng.2025.08.001

As the semiconductor industry advances toward higher performance and integration, precise wafer back grinding has become increasingly vital. This study introduces an innovative, in-house wafer back grinding system that features a non-contact laser displacement sensor for inline Total Thickness Varia...