A Process for Laser-Induced Graphene on Any Substrate

In this work, a versatile approach for the creation of laser-induced graphene (LIG) onto virtually any kind of substrate is demonstrated. The process is based on preconditioning the substrate with a layer of polyimide sealing resin and subsequently laser scribing the LIG structure onto it. By optimi...

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Published inIEEE journal on flexible electronics Vol. 3; no. 2; pp. 65 - 71
Main Authors Neumaier, Lukas, Rauter, Lukas, Lengger, Sabine K., Khan, Sherjeel, Beduk, Tutku, Kosel, Jurgen
Format Journal Article
LanguageEnglish
Published IEEE 01.02.2024
Subjects
Additive manufacturing
Glass
Graphene
laser-induced graphene (LIG)
Resins
Sensors
strain gauge
Substrates
Temperature measurement
Temperature sensors
Online AccessGet full text
ISSN2768-167X
2768-167X
DOI10.1109/JFLEX.2023.3329456

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Abstract In this work, a versatile approach for the creation of laser-induced graphene (LIG) onto virtually any kind of substrate is demonstrated. The process is based on preconditioning the substrate with a layer of polyimide sealing resin and subsequently laser scribing the LIG structure onto it. By optimizing the laser process, the resulting LIG is firmly attached to the substrate and the unutilized resin is entirely removed. Most substrates are not amenable for LIG fabrication, including glass or metals. Using this process, LIG strain, temperature, as well as humidity sensors have been fabricated on various substrates. The process features the same advantages of easy and fast patterning which LIG is well-known for and enables sensor fabrication directly on the substrate.
AbstractList In this work, a versatile approach for the creation of laser-induced graphene (LIG) onto virtually any kind of substrate is demonstrated. The process is based on preconditioning the substrate with a layer of polyimide sealing resin and subsequently laser scribing the LIG structure onto it. By optimizing the laser process, the resulting LIG is firmly attached to the substrate and the unutilized resin is entirely removed. Most substrates are not amenable for LIG fabrication, including glass or metals. Using this process, LIG strain, temperature, as well as humidity sensors have been fabricated on various substrates. The process features the same advantages of easy and fast patterning which LIG is well-known for and enables sensor fabrication directly on the substrate.
Author Rauter, Lukas
Khan, Sherjeel
Neumaier, Lukas
Lengger, Sabine K.
Kosel, Jurgen
Beduk, Tutku
Author_xml – sequence: 1
  givenname: Lukas
  orcidid: 0000-0001-7736-7298
  surname: Neumaier
  fullname: Neumaier, Lukas
  email: lukas.neumaier@silicon-austria.com
  organization: Sensor Systems Division, Silicon Austria Labs GmbH, Villach, Austria
– sequence: 2
  givenname: Lukas
  orcidid: 0000-0003-1372-8183
  surname: Rauter
  fullname: Rauter, Lukas
  email: lukas.rauter@silicon-austria.com
  organization: Sensor Systems Division, Silicon Austria Labs GmbH, Villach, Austria
– sequence: 3
  givenname: Sabine K.
  surname: Lengger
  fullname: Lengger, Sabine K.
  email: sabine.lengger@silicon-austria.com
  organization: Sensor Systems Division, Silicon Austria Labs GmbH, Villach, Austria
– sequence: 4
  givenname: Sherjeel
  surname: Khan
  fullname: Khan, Sherjeel
  email: sherjeel.khan@silicon-austria.com
  organization: Sensor Systems Division, Silicon Austria Labs GmbH, Villach, Austria
– sequence: 5
  givenname: Tutku
  orcidid: 0000-0001-7365-6404
  surname: Beduk
  fullname: Beduk, Tutku
  email: tutku.beduek@silicon-austria.com
  organization: Sensor Systems Division, Silicon Austria Labs GmbH, Villach, Austria
– sequence: 6
  givenname: Jurgen
  orcidid: 0000-0002-8998-8275
  surname: Kosel
  fullname: Kosel, Jurgen
  email: juergen.kosel@silicon-austria.com
  organization: Sensor Systems Division, Silicon Austria Labs GmbH, Villach, Austria
BookMark eNp9kMFKAzEQhoNUsNa-gHjIC2ydSbJp9lhKWysLCir0tsRkFldqtiTbQ9_ere1BPHgYZi7f_D_fNRuENhBjtwgTRCjuH5flYjMRIORESlGoXF-woZhqk6Gebga_7is2TukTAEShURoYsnzGn2PrKCVet5GXNlHM1sHvHXm-inb3QYF4G_gsHPjL_j110XZ0wy5ru000Pu8Re1suXucPWfm0Ws9nZebQyC4jW3upQWrdh6vcO-2tN1BYQJ0bgZYKidYYdF6QA-Wl7EepwgEq4XM5Yub018U2pUh15ZrOdk0b-hrNtkKojgaqHwPV0UB1NtCj4g-6i82XjYf_obsT1BDRL0CCEqjlN2SoZ54
CODEN IJFEBL
CitedBy_id crossref_primary_10_1021_acsami_4c13124
crossref_primary_10_1039_D4SD00010B
crossref_primary_10_1002_adsr_202200073
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ContentType Journal Article
DBID 97E
RIA
RIE
AAYXX
CITATION
DOI 10.1109/JFLEX.2023.3329456
DatabaseName IEEE Xplore (IEEE)
IEEE All-Society Periodicals Package (ASPP) 1998–Present
IEEE Electronic Library (IEL)
CrossRef
DatabaseTitle CrossRef
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2768-167X
EndPage 71
ExternalDocumentID 10_1109_JFLEX_2023_3329456
10304216
Genre orig-research
GrantInformation_xml – fundername: Austrian Association for the Electric and Electronics Industry (FEEI)
– fundername: Styrian Business Promotion Agency (SFG)
– fundername: Upper Austrian Research (UAR)
– fundername: Silicon Austria Labs (SAL), owned by the Republic of Austria
  funderid: 10.13039/100018461
– fundername: Federal State of Carinthia
GroupedDBID 0R~
97E
AASAJ
AAWTH
ABJNI
ABQJQ
ABVLG
AGQYO
AHBIQ
AKJIK
AKQYR
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
IFIPE
JAVBF
OCL
RIA
RIE
AAYXX
CITATION
ID FETCH-LOGICAL-c183t-eafd36036616745dc6dad809a0165821ae931a881cd2ec04d334d3449c0142d53
IEDL.DBID RIE
ISSN 2768-167X
IngestDate Thu Apr 24 23:06:50 EDT 2025
Tue Jul 01 03:01:02 EDT 2025
Wed Aug 27 02:12:29 EDT 2025
IsPeerReviewed false
IsScholarly true
Issue 2
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c183t-eafd36036616745dc6dad809a0165821ae931a881cd2ec04d334d3449c0142d53
ORCID 0000-0001-7365-6404
0000-0003-1372-8183
0000-0001-7736-7298
0000-0002-8998-8275
PageCount 7
ParticipantIDs crossref_citationtrail_10_1109_JFLEX_2023_3329456
ieee_primary_10304216
crossref_primary_10_1109_JFLEX_2023_3329456
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2024-Feb.
2024-2-00
PublicationDateYYYYMMDD 2024-02-01
PublicationDate_xml – month: 02
  year: 2024
  text: 2024-Feb.
PublicationDecade 2020
PublicationTitle IEEE journal on flexible electronics
PublicationTitleAbbrev JFLEX
PublicationYear 2024
Publisher IEEE
Publisher_xml – name: IEEE
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– ident: ref20
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– ident: ref2
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– ident: ref17
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– ident: ref7
  doi: 10.1002/adma.201901981
– ident: ref6
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– ident: ref1
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– ident: ref10
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– ident: ref22
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– ident: ref5
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– ident: ref12
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– ident: ref28
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– ident: ref8
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– ident: ref26
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– ident: ref3
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– ident: ref15
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SSID ssj0002961380
Score 2.2662866
Snippet In this work, a versatile approach for the creation of laser-induced graphene (LIG) onto virtually any kind of substrate is demonstrated. The process is based...
SourceID crossref
ieee
SourceType Enrichment Source
Index Database
Publisher
StartPage 65
SubjectTerms Additive manufacturing
Glass
Graphene
laser-induced graphene (LIG)
Resins
Sensors
strain gauge
Substrates
Temperature measurement
Temperature sensors
Title A Process for Laser-Induced Graphene on Any Substrate
URI https://ieeexplore.ieee.org/document/10304216
Volume 3
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07a8MwED6aTO3QZ0rTFxq6FTvWw4o1hpI0hDRTA9mMLZ2XFqcEZ2h_fSXZCabQ0sFgjARCd9adpPu-D-BBIjN57JgfE6oDUTAT5GrIA5pRpAUKRM9T8LKQ06WYreJVA1b3WBhE9MVnGLpXf5dv1nrrjsoGThJLMCo70LF-VoO19gcqTNnIlEQ7YEykBrPJfLwKnT54yDlTwolUt4JPS03FB5PJCSx2w6hrSN7CbZWH-usHQ-O_x3kKx01aSUa1H5zBAZbncNQiG7yAeEQaVACxiSqZ2_C1CZxyh0ZDnh1vtV32yLoko_KTuPXE89b2YDkZvz5Ng0Y0IdD276wCzArDpY1L0uELYqOlyUwSqczhlhJGM1ScZom1jGGoI2E4t48QStvNEjMxv4RuuS7xCoiOMo4KZRExLZyQn5FDrpXKFcul0LwPdDebqW4YxZ2wxXvqdxaRSr0FUmeBtLFAHx73fT5qPo0_W_fc7LZa1hN7_cv3Gzi03UVdVX0L3WqzxTubNFT5vXeWb0Nru-M
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwELagDMDAs4jy9MCGksaPuPFYoZZS0k6t1C1K7MsCSlGVDvDrsZ20ipBADJGiyImsO8d3tu_7PoQeBFCdhZb5MSLK4znVXiZ7zCMpAZIDB3A8BZOpGM35eBEuarC6w8IAgCs-A9_eurN8vVRru1XWtZJYnBKxi_ZM4OdhBdfabqlQaWJTFGygMYHsjofxYOFbhXCfMSq5laluhJ-GnooLJ8NjNN10pKoiefPXZearrx8cjf_u6Qk6qhNL3K9GwinageIMHTboBs9R2Mc1LgCbVBXHJoCtPKvdoUDjZ8tcbSY-vCxwv_jEdkZxzLVtNB8OZk8jr5ZN8JT5P0sP0lwzYSKTsAiDUCuhUx0FMrXIpYiSFCQjaWR8oymogGvGzMW5VGa5RHXILlCrWBZwibAKUgYSRB5Qxa2UnxY9pqTMJM0EV6yDyMaaiao5xa20xXvi1haBTJwHEuuBpPZABz1u3_moGDX-bN221m20rAx79cvze7Q_mk3iJH6Zvl6jA_MpXtVY36BWuVrDrUkhyuzODZxvTKO_MA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=A+Process+for+Laser-Induced+Graphene+on+Any+Substrate&rft.jtitle=IEEE+journal+on+flexible+electronics&rft.au=Neumaier%2C+Lukas&rft.au=Rauter%2C+Lukas&rft.au=Lengger%2C+Sabine+K.&rft.au=Khan%2C+Sherjeel&rft.date=2024-02-01&rft.pub=IEEE&rft.eissn=2768-167X&rft.volume=3&rft.issue=2&rft.spage=65&rft.epage=71&rft_id=info:doi/10.1109%2FJFLEX.2023.3329456&rft.externalDocID=10304216
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2768-167X&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2768-167X&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2768-167X&client=summon