Evaluation of Carbon-Based Interconnects for Digital Signaling in Printed Flexible Electronics on Sustainable Substrates

• Published in: IEEE journal on flexible electronics Vol. 4; no. 5; pp. 209 - 217
• Main Authors: Wang, Zixin, Saleh, Mahdi, Alwattar, Aula, Alfredsson, Maria, Horne, Robert J., Ang, Chee S., Condell, Joan, Flowers, Emily, Matcham, Faith, Robinson, Tony, Rooksby, John, Saha, Sian, Rose, Louise, Batchelor, John C., Casson, Alexander J.
• Format: Journal Article
• Language: English
• Published: IEEE 01.05.2025
• Subjects: Carbon; Digital communication; Flexible electronics; impedance; Ink; Integrated circuit interconnections; Printing; screen printing; Sensors; Silver; Substrates; Sustainable development; sustainable electronics; Thermal stability

Printed electronics using flexible substrates are an emerging area, allowing next-generation electronics to conform and flex with different surfaces, from human skin to clothing. In the hybrid integration or sea-of-rigids, approach, conventional microchips are mounted onto (generally) plastic substr...