A Decreasing Mechanism of the Removal Rate in Wafer Polishing Process - NISHIGUCHI, Takashi; MASUDA, Masami; SASAKI, Hirotaka; OOKAWA, Tetsuo (Journal of the Japan Society for Precision Engineering, Contributed Papers, 2006)
Keywords: creep; elastic deformation; polishing pad; polishing removal rate; Si wafer; slurry